H01J 2237/2561
Electron
Official title: electron
H01J2237/2561 (Electron) appears on 55 US grants and 41 published applications in this corpus.
Search patents in H01J- Granted patents
- 55
- Published applications
- 41
- Assignees
- 32
- Inventors
- 109
- Latest grant
- 7 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 4 | 0 |
| 2003 | 3 | 3 |
| 2004 | 8 | 2 |
| 2005 | 2 | 2 |
| 2006 | 3 | 2 |
| 2007 | 2 | 1 |
| 2008 | 1 | 3 |
| 2009 | 4 | 6 |
| 2010 | 3 | 0 |
| 2011 | 2 | 1 |
| 2012 | 0 | 0 |
| 2013 | 1 | 0 |
| 2014 | 0 | 1 |
| 2015 | 1 | 4 |
| 2016 | 2 | 2 |
| 2017 | 2 | 2 |
| 2018 | 0 | 0 |
| 2019 | 2 | 2 |
| 2020 | 2 | 3 |
| 2021 | 2 | 0 |
| 2022 | 1 | 3 |
| 2023 | 2 | 1 |
| 2024 | 0 | 1 |
| 2025 | 1 | 1 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Information processing system and phase analysis system7 Jul 2026US 12,676,287 B2Hitachi, Ltd.
- 3D metrology from 3D datacube created from stack of registered images obtained during delayering of the sample8 Apr 2025US 12,272,518 B2Applied Materials Israel Ltd.
- 3D metrology from 3D datacube created from stack of registered images obtained during delayering of the sample15 Aug 2023US 11,728,126 B2Applied Materials Israel Ltd.
- X-ray detection apparatus and method11 Jul 2023US 11,699,567 B2JEOL Ltd.
- X-ray imaging in cross-section using un-cut lamella with background material15 Nov 2022US 11,501,951 B1Applied Materials Israel Ltd.
- Analyzer and Analysis Method27 Aug 2026US 2026/0251596 A1JEOL Ltd.
- 3d metrology from 3d datacube created from stack of registered images obtained during delayering of the sample26 Jun 2025US 2025/0210301 A1Applied Materials Israel Ltd.
- Information processing system and phase analysis system13 Jun 2024US 2024/0192152 A1Hitachi, Ltd.
- 3d metrology from 3d datacube created from stack of registered images obtained during delayering of the sample19 Oct 2023US 2023/0335370 A1Applied Materials Israel Ltd.
- 3d metrology from 3d datacube created from stack of registered images obtained during delayering of the sample29 Dec 2022US 2022/0415610 A1Applied Materials Israel Ltd.
Most cited
By later US patents
- Non-destructive root cause analysis on blocked contact or via44US 6,777,676 B1KLA-Tencor Technologies Corporation · 2004
- Charged particle inspection method and charged particle system32US 10,354,831 B2Applied Materials Israel Ltd. · 2019
- System and method for automatic analysis of defect material on semiconductors27US 6,407,386 B1APPLIED Materials.Inc. · 2002
- Electron microscope including apparatus for X-ray analysis and method of analyzing specimens using same26US 6,765,205 B2Hitachi High-Technologies Corporation · 2004
- Charged particle-optical systems, methods and components21US 8,039,813 B2Applied Materials Israel Ltd. · 2011