H01C 17/16
Using electric current
Official title: using electric current
H01C17/16 (Using electric current) appears on 16 US grants and 8 published applications in this corpus.
Search patents in H01C- Granted patents
- 16
- Published applications
- 8
- Assignees
- 10
- Inventors
- 19
- Latest grant
- 15 Oct 2019
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 1 |
| 2002 | 2 | 3 |
| 2003 | 2 | 2 |
| 2004 | 1 | 1 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Chip resistor and method for producing the same15 Oct 2019US 10,446,295 B2Koa Corporation
- Electrical, thin film termination6 Jan 2004US 6,674,053 B2Trebor International, Inc.
- Method for adhering a resistive coating to a substrate16 Dec 2003US 6,663,914 B2Trebor International, Inc.
- Durable, non-reactive, resistive-film heater17 Jun 2003US 6,580,061 B2Trebor International, Inc.
- Method for forming a resistor12 Nov 2002US 6,479,094 B2Trebor International, Inc.
- Chip resistor and method for producing the same31 Jan 2019US 2019/0035520 A1Koa Corporation
- Electrical, thin film termination9 Sep 2004US 2004/0173602 A1
- Composition and method for manufacturing integral resistors in printed circuit boards13 Mar 2003US 2003/0048172 A1Oak-Mitsui, Inc.
- Electrical, thin film termination13 Feb 2003US 2003/0029860 A1Trebor International, Inc.
- Method for adhering a resistive coating to a substrate5 Dec 2002US 2002/0182861 A1Trebor International, Inc.
Most cited
By later US patents
- Circuit board material and electroplating bath for the production thereof64US 4,892,776 AOhmega Electronics, Inc. · 1990
- Circuit board material and method of making63US 4,888,574 A501 Ohmega Electronics, Inc. · 1989
- Circuit board material36US 4,808,967 AOhmega Electronics, Inc. · 1989
- Resistive metal layers and method for making same33US 5,243,320 AGould Inc. · 1993
- Method for producing a circuit board material employing an improved electroplating bath17US 5,336,391 AOhmega Electronics, Inc. · 1994