Method for adhering a resistive coating to a substrate
AssigneeTrebor International, Inc.
InventorSteven A. Black
Life of this patent
Estimating the term…
Abstract
A method for adhering a resistive coating to a substrate for use in process fluids employed in the semiconductor processing industry in clean, particle-free, nonreactive, non-trapping, ultra-pure, thermally tolerant, sealed systems. In one arrangement, the method may include the steps of selecting a substrate having a wall, modifying a surface of the wall to provide a roughened texture suitable for mechanically securing a coating thereto, and applying a conductive coating that is configured to be electrically resistive, to extend over at least a portion of the roughened texture, and to adhere thereto throughout variations in operational temperatures thereof.
Claims34
A method for adhering an electrically resistive coating to a substrate for implementing an electrical device, the method comprising:
- selecting a substrate having a wall having an outer surface;
- modifying, exclusively by mechanical erosion, the outer surface to provide a textured region having sharp edged inclusions to mechanically secure a coating thereto;
- and
- applying a coating comprising a conductor configured to be electrically resistive, to extend over at least a portion of the textured region, and to adhere to the outer surface by micro-mechanical bonding with the sharp edged inclusions under stresses due to a differential in respective coefficients of thermal expansion thereof.
A method for adhering an electrically resistive coating, the method comprising:
- selecting a conduit having a wall having an outer surface;
- modifying a portion of the outer surface exclusively by mechanical abrasion to provide a textured region having inclusions with sharp edges;
- and
- applying a coating comprising a conductor configured to be electrically resistive, to extend over at least a portion of the textured region, and to adhere to the textured region by micro-mechanical gripping of the inclusions under stresses due to a differential in respective coefficients of thermal expansion thereof.
A method for adhering an electrically resistive coating, the method comprising:
- selecting a conduit having a wall forming an enclosed, fluid flow path, the wall having an exterior surface;
- generating a textured surface by mechanically abrading a portion of the exterior surface to form crystalline, angular peaks and valleys;
- selecting an electroless coating comprising an electrically resistive conductor;
- applying the electroless coating to the crystalline, angular peaks and valleys of at least a portion of the textured surface to adhere thereto by micro-mechanical gripping to promote localized bending thereof to relieve stress during expansion due to increases in temperature.
Dependencies are inferred from the claim text.