Method for forming a resistor
AssigneeTrebor International, Inc.
InventorSteven A. Black
Life of this patent
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Abstract
A method for forming a resistor on a roughened surface for use in process fluids employed in the semiconductor-processing industry as part of a clean, particle-free, nonreactive, non-trapping, ultra-pure, thermally tolerant, sealed system. In one arrangement, the method for forming the resistor includes the steps of selecting a coating for the roughened surface from among the group of resistive materials, roughening a surface to promote mechanical adherence of the coating to the selection of a coating comprising resistive material, roughening a surface for promoting mechanical adherence of the resistive material thereto, and electroplating the resistive material onto the roughened surface to provide a uniformly controllable resistance in the coating.
Claims30
A method for forming a resistor, the method comprising:
- selecting a coating comprising a resistive material having a first coefficient of thermal expansion;
- roughening a surface of a substrate material, having a second coefficient of thermal expansion less than the first coefficient of thermal expansion, to form inclusions for securing the coating thereto;
- and
- plating the resistive material onto the roughened surface in a crepe pattern configured to substantially limit the ability of the resistive material to resist bending in response to thermal stress and in a manner effective to provide a uniform electrical resistivity in the coating.
Dependencies are inferred from the claim text.