Method for adhering a resistive coating to a substrate
AssigneeTrebor International, Inc.
InventorSteven A. Black
Life of this patent
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Abstract
A method for adhering a resistive coating to a substrate for use in process fluids employed in the semiconductor processing industry in clean, particle-free, nonreactive, non-trapping, ultra-pure, thermally tolerant, sealed systems. In one arrangement, the method may include the steps of selecting a substrate having a wall, modifying a surface of the wall to provide a roughened texture suitable for mechanically securing a coating thereto, and applying a conductive coating that is configured to be electrically resistive, to extend over at least a portion of the roughened texture, and to adhere thereto throughout variations in operational temperatures thereof.
Claims34
A method for adhering an electrically resistive coating to a substrate for implementing an electrical device, the method comprising:
- selecting a substrate having a wall having an outer surface;
- modifying the wall surface to provide a roughened texture configured to mechanically secure a coating thereto;
- and
- applying a coating comprising a conductor configured to be electrically resistive, to extend over at least a portion of the roughened texture, and to adhere to the outer surface by micro-mechanical bonding under stresses due to a differential in respective coefficients of thermal expansion thereof.
Dependencies are inferred from the claim text.