Chip resistor and method for producing the same
AssigneeKoa Corporation
InventorYasushi Hiroshima
Life of this patent
Estimating the term…
Abstract
Provided is a thin-film chip resistor including an insulating substrate; a thin-film resistive element formed on the substrate; a pair of electrodes connected to the thin-film resistive element; and a protective film covering at least the thin-film resistive element between the pair of electrodes, in which the protective film includes a first protective film and a second protective film, the first protective film containing silicon nitride in contact with the thin-film resistive element, and the second protective film containing silicon oxide in contact with the first protective film.
Claims8
A thin-film chip resistor comprising:
- an insulating substrate;
- a thin-film resistive element formed on the substrate;
- a pair of electrodes connected to the thin-film resistive element;
- and
- a protective film covering at least the thin-film resistive element between the pair of electrodes,
- wherein:
- the protective film includes a first protective film and a second protective film, the first protective film containing silicon nitride in contact with the thin-film resistive element, and the second protective film containing silicon oxide in contact with the first protective film.
A method for producing a thin-film chip resistor, comprising:
- preparing an insulating substrate;
- forming, on the substrate, a thin-film resistive element and a pair of electrodes connected to the thin-film resistive element, and forming a first protective film containing silicon nitride, the first protective film covering the thin-film resistive element between the pair of electrodes;
- and
- forming a second protective film containing silicon oxide, the second protective covering the first protective film.
Dependencies are inferred from the claim text.