Resistive metal layers and method for making same
AssigneeGould Inc.
InventorsSidney J. Clouser, Chinho Lee, Mary K. Prokop, Christopher J. Whevell
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Abstract
Electrodeposited planar resistive layers are disclosed, which may be combined with conductive layers and insulative layers to produce laminates useful in the preparation of printed circuit boards. The resistive layers are prepared by electroplating from an electroplating bath containing a source of a normally conductive metal component and a source of a non-metallic resistance increasing additive. Planar resistors may be produced which have sheet resistances in the range of from about 15 to about 1000 .OMEGA. per square.
Claims27
A resistive layer comprising a composite of a normally conductive metal component and a resistance increasing amount of a non-metallic additive wherein
- said metal component comprises chromium;
- said non-metallic additive comprises an average of at least about 0.001 atom of carbon or nitrogen, or combination of two or more of carbon, nitrogen and phosphorus, per atom of said normally conductive metal component in the bulk of the resistive layer;
- and
- said metal component comprises an average of at least about 80 weight percent of the bulk of the resistive layer.
A resistive layer comprising a composite of a normally conductive metal component and a resistance increasing amount of a non-metallic additive wherein
- said metal component comprises the combination of chromium and a metal selected from the group consisting of cobalt, vanadium, molybdenum or tungsten;
- and
- said non-metallic additive comprises an average of at least about 1 atom of carbon, nitrogen or phosphorus, or a combination of two or more of carbon, nitrogen or phosphorus, per 1000 atoms of said metallic component.
A resistive layer comprising a composite of a said normally conductive metal component and a resistance increasing amount of a said non-metallic component wherein
- said metal component comprises chromium;
- said non-metallic additive comprises carbon and oxygen;
- and
- the resistive layer has a thickness in the range from about 0.1 to about 0.4 microns and a sheet resistance in the range from about 15 to about 1000 .OMEGA. per square.
A printed circuit board comprising an insulative layer and a resistive line bonded to the insulative layer, said resistive line comprising a composite of a normally conductive metal component and a resistance increasing amount of a non-metallic additive wherein
- said metal component comprises chromium;
- said non-metallic additive comprises an average of at least 0.001 atom of carbon or nitrogen, or a combination of two or more of carbon, nitrogen and phosphorus, per atom of said normally conductive metal component in the bulk of the resistive layer;
- and
- said metal component comprises an average of at least 80 weight percent of the bulk of the resistive layer.
A printed circuit board comprising an insulative layer and a resistive line bonded to the insulative layer, said resistive line comprising a composite of a normally conductive metal component and a resistance increasing amount of a non-metallic additive wherein
- said metal component comprises the combination of chromium and a metal selected from the group consisting of cobalt, vanadium, molybdenum or tungsten;
- and
- said non-metallic additive comprises an average of at least about 1 atom of carbon, nitrogen or phosphorus, or a combination of two or more of carbon, nitrogen or phosphorus, per 1000 atoms of said metallic component.
Dependencies are inferred from the claim text.