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US 5,336,391 AGranted
Method for producing a circuit board material employing an improved electroplating bath
AssigneeOhmega Electronics, Inc.
InventorJames M. Rice
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AssigneeOhmega Electronics, Inc.
InventorJames M. Rice
Estimating the term…
An improved circuit board material having a support layer, an electrical resistance layer and a conductive layer. The circuit board material has a resistance of at least about 500 ohms/square. The circuit board material is formed by electro-plating the electrical resistance layer on the conductive layer. The conductive layer is desirably activated prior to electro-deposition of the electrical resistance layer thereon. The conductive layer is activated by contacting with an activating agent such as benzotriazole electrolytic chromate and the like. A preferred electro-plating bath for electro-deposition of the electrical resistance layer comprises about 0.5 mole per liters nickel hypophosphite. The disclosed electro-plating bath functions at ambient temperatures and is effectively temperature independent. Circuit boards can be formed from the circuit board material through a process involving only two etching steps.
In a method for preparing a circuit board material comprising a conductive layer having an electrical resistance material layer electroplated thereon, the improvement comprising electro-plating a nickel-phosphorus electrical resistance layer on said conductive layer using an electroplating bath consisting essentially of at least about 0.25 moles per liter nickel ions and at least about 0.05 moles per liter hypophosphite ions at a temperature within the range of from about 20.degree. to 50.degree. C., wherein said electrical resistance layer comprises about 10 to about 50 percent by weight of phosphorus.
A method of preparing a circuit board material comprising a conductive layer having a nickel-phosphorus electrical resistance layer electroplated thereon, the method comprising the following steps:
Dependencies are inferred from the claim text.