G11C 7/1003
Interface circuits for daisy chain or ring bus memory arrangements
Official title: {Interface circuits for daisy chain or ring bus memory arrangements}
G11C7/1003 (Interface circuits for daisy chain or ring bus memory arrangements) appears on 106 US grants and 119 published applications in this corpus.
Search patents in G11C- Granted patents
- 106
- Published applications
- 119
- Assignees
- 34
- Inventors
- 187
- Latest grant
- 24 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2005 | 0 | 1 |
| 2006 | 1 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 2 |
| 2009 | 1 | 2 |
| 2010 | 1 | 3 |
| 2011 | 0 | 0 |
| 2012 | 2 | 2 |
| 2013 | 2 | 4 |
| 2014 | 3 | 7 |
| 2015 | 9 | 7 |
| 2016 | 5 | 16 |
| 2017 | 9 | 7 |
| 2018 | 5 | 4 |
| 2019 | 10 | 8 |
| 2020 | 9 | 9 |
| 2021 | 9 | 7 |
| 2022 | 6 | 5 |
| 2023 | 9 | 11 |
| 2024 | 12 | 14 |
| 2025 | 12 | 8 |
| 2026 | 1 | 2 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Memory module and system supporting parallel and serial access modes24 Mar 2026US 12,586,617 B2Rambus Inc.
- Inrush current management in a memory array16 Dec 2025US 12,499,917 B2Arm Limited
- Repeater scheme for inter-die signals in multi-die package11 Nov 2025US 12,469,823 B2Micron Technology, Inc.
- Programmable signal processing apparatus28 Oct 2025US 12,456,503 B2Canon Kabushiki Kaisha
- Memory die stack chip ID-based command structure21 Oct 2025US 12,450,012 B2Micron Technology, Inc.
- Storage device including ring wire, and method of operating the same16 Jul 2026US 2026/0204296 A1Samsung Electronics Co., Ltd.
- Repeater scheme for inter-die signals in multi-die package16 Apr 2026US 2026/0107843 A1Micron Technology, Inc.
- Stacked Memory Device with Paired Channels18 Dec 2025US 2025/0383816 A1Rambus Inc.
- Inter-die signal load reduction technique in multi-die package11 Dec 2025US 2025/0379190 A1Micron Technology, Inc.
- Inrush current management in a memory array31 Jul 2025US 2025/0246214 A1Arm Limited
Most cited
By later US patents
- Buffer die in stacks of memory dies and methods28US 8,582,373 B2Micron Technology, Inc. · 2013
- Independent write and read control in serially-connected devices26US 8,825,967 B2Conversant Intellectual Property Management Inc. · 2014
- Solid state drive memory system18US 9,128,662 B2NovaChips Canada Inc. · 2015
- Memory module and system supporting parallel and serial access modes16US 9,792,965 B2Rambus Inc. · 2017
- System and method for providing synchronous dynamic random access memory (SDRAM) mode register shadowing in a memory system15US 7,624,225 B2International Business Machines Corporation · 2009