G06T 2207/10061
From scanning electron microscope
Official title: from scanning electron microscope
G06T2207/10061 (From scanning electron microscope) appears on 994 US grants and 1,335 published applications in this corpus.
Search patents in G06T- Granted patents
- 994
- Published applications
- 1,335
- Assignees
- 295
- Inventors
- 2,499
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 5 | 0 |
| 2000 | 3 | 0 |
| 2001 | 3 | 0 |
| 2002 | 2 | 4 |
| 2003 | 7 | 2 |
| 2004 | 1 | 3 |
| 2005 | 3 | 3 |
| 2006 | 5 | 6 |
| 2007 | 4 | 6 |
| 2008 | 3 | 12 |
| 2009 | 2 | 22 |
| 2010 | 9 | 11 |
| 2011 | 15 | 29 |
| 2012 | 18 | 30 |
| 2013 | 23 | 46 |
| 2014 | 29 | 41 |
| 2015 | 46 | 35 |
| 2016 | 31 | 31 |
| 2017 | 35 | 62 |
| 2018 | 51 | 45 |
| 2019 | 60 | 94 |
| 2020 | 90 | 97 |
| 2021 | 77 | 119 |
| 2022 | 83 | 144 |
| 2023 | 92 | 139 |
| 2024 | 88 | 122 |
| 2025 | 122 | 142 |
| 2026 | 79 | 90 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- System and method for evaluating voids and particles in solids6 Oct 2026US 12,755,355 B2Schlumberger Technology Corporation
- Wafer measurement apparatus and operating method thereof15 Sep 2026US 12,736,488 B2Samsung Electronics Co., Ltd.
- Method of removing defect of mask15 Sep 2026US 12,736,870 B2Samsung Electronics Co., Ltd.
- Scanning electron microscope image processing using neural network15 Sep 2026US 12,738,013 B2Samsung Electronics Co., Ltd.
- Automated application of drift correction to sample studied under electron microscope15 Sep 2026US 12,739,513 B2Protochips, Inc.
- Dimension Measurement System, Estimation System, and Dimension Measurement Method8 Oct 2026US 2026/0311356 A1Hitachi High-Tech Corporation
- Apparatus and methods to generate deblurring model and deblur image1 Oct 2026US 2026/0301135 A1ASML Netherlands B. V.
- Method for measuring overlay using scanning electron microscope device1 Oct 2026US 2026/0301156 A1Samsung Electronics Co., Ltd.
- System and method for detecting defects on a wafer and related non-transitory computer-readable medium1 Oct 2026US 2026/0305262 A1Taiwan Semiconductor Manufacturing Company.Ltd
- System and method for imaging of tissue samples24 Sep 2026US 2026/0289776 A1
Most cited
By later US patents
- Visual inspection method and apparatus therefor98US 6,587,581 B1Hitachi, Ltd. · 2003
- Defect monitoring in semiconductor device fabrication82US 8,339,449 B2Globalfoundries Singapore Pte. Ltd. · 2012
- Method and apparatus for analyzing failure of semiconductor wafer77US 5,828,778 AMatsushita Electric Industrial Co., Ltd. · 1998
- Pattern image correcting apparatus, pattern inspection apparatus, and pattern image correcting method76US 8,019,144 B2Kabushiki Kaisha Toshiba · 2011
- Image-formation apparatus using charged particle beams under various focus conditions68US 6,538,249 B1Hitachi, Ltd. · 2003