Defect monitoring in semiconductor device fabrication
AssigneeGlobalfoundries Singapore Pte. Ltd.
InventorsBarbara Fong Chin Lim, Keng Heng Lai, Tanya Yang, Victor Seng Keong Lim, Fang Hong Gn, Liang Choo Hsia
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Abstract
A method of forming a device is presented. The method includes providing a substrate containing at least a partially formed device thereon. The device comprises at least one defect site. A pixilated image of the defect site is acquired, and each pixel comprises a grey level value (GLV). Surrounding noises of the defect site is eliminated. A point of the image is identified as the center of the defect. A plurality of iterations to exclude outer edge pixels surrounding the center of the defect image is performed. The defect is categorized as a killer or non-killer defect.
Claims20
A method of forming a device comprising:
- providing a substrate containing at least a partially formed device thereon, wherein the device comprises at least one defect site;
- acquiring a pixilated image of the defect site selected, wherein each pixel comprises a grey level value (GLV);
- eliminating surrounding noises of the defect site;
- identifying a point of the image as the center of the defect;
- performing a plurality of iterations to exclude outer edge pixels surrounding the center of the defect image;
- and
- categorizing the defect as a killer defect or a non-killer defect.
A method of forming a device comprising:
- providing a substrate containing at least a partially formed device thereon, wherein the device comprises at least one defect site;
- acquiring a pixilated image of the defect site selected, wherein each pixel comprises a grey level value (GLV);
- eliminating surrounding noises of the defect site;
- identifying a point of the image as the center of the defect wherein the center of the defect comprises
- one pixel or adjacent pixels having the highest GLV in a bright voltage contrast (BVC) defect site, or
- one pixel or adjacent pixels having the lowest GLV in a dark voltage contrast (DVC) defect site;
- performing a plurality of iterations to exclude outer edge pixels surrounding the center of the defect image;
- and
- categorizing the defect as a killer defect or a non-killer defect.
A system for monitoring defects comprises:
- means for providing a substrate containing at least a partially formed device thereon, wherein the device comprises at least one defect site;
- means for acquiring a pixilated image of the defect site selected, wherein each pixel comprises a grey level value (GLV);
- means for eliminating surrounding noises of the defect site;
- means for identifying a point of the image as the center of the defect;
- means for performing a plurality of iterations to exclude outer edge pixels surrounding the center of the defect image;
- and
- means for categorizing the defect as a killer defect or a non-killer defect.
Dependencies are inferred from the claim text.