G03F 7/0955
One of the photosensitive systems comprising a non-macromolecular photopolymerisable compound having carbon-to-carbon
Official title: {one of the photosensitive systems comprising a non-macromolecular photopolymerisable compound having carbon-to-carbon double bonds, e.g. ethylenic compounds}
G03F7/0955 (One of the photosensitive systems comprising a non-macromolecular photopolymerisable compound having carbon-to-carbon) appears on 101 US grants and 59 published applications in this corpus.
Search patents in G03F- Granted patents
- 101
- Published applications
- 59
- Assignees
- 60
- Inventors
- 239
- Latest grant
- 5 Aug 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 3 | 0 |
| 1982 | 8 | 0 |
| 1983 | 2 | 0 |
| 1984 | 3 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 4 | 0 |
| 1990 | 6 | 0 |
| 1991 | 3 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 4 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 6 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 3 | 1 |
| 2003 | 1 | 1 |
| 2004 | 0 | 3 |
| 2005 | 0 | 8 |
| 2006 | 2 | 2 |
| 2007 | 4 | 4 |
| 2008 | 2 | 1 |
| 2009 | 1 | 2 |
| 2010 | 0 | 3 |
| 2011 | 2 | 2 |
| 2012 | 2 | 1 |
| 2013 | 1 | 2 |
| 2014 | 1 | 4 |
| 2015 | 4 | 1 |
| 2016 | 1 | 1 |
| 2017 | 3 | 4 |
| 2018 | 2 | 1 |
| 2019 | 2 | 4 |
| 2020 | 2 | 7 |
| 2021 | 2 | 1 |
| 2022 | 2 | 2 |
| 2023 | 2 | 0 |
| 2024 | 2 | 0 |
| 2025 | 1 | 4 |
By publication year. Applications have been published since 2001.
Recent patents
- Component carrier with a photoimageable dielectric layer and a structured conductive layer being used as a mask for selectively exposing the photoimageable dielectric layer with electromagnetic radiation5 Aug 2025US 12,381,138 B2AT&SAustria Technologie & Systemtechnik AG
- Quantum dot layer and manufacturing method thereof, quantum dot color filter, color filter substrate, display panel, and display device18 Jun 2024US 12,012,539 B2Boe Technology Group Co., Ltd.
- Method of forming patterns using resist underlayer composition14 May 2024US 11,982,943 B2Samsung SDI.Co., Ltd.
- Relief precursor having low cupping and fluting21 Nov 2023US 11,822,246 B2Flint Group Germany GmbH
- Bottom-up conformal coating and photopatterning on PAG-immobilized surfaces26 Sep 2023US 11,768,435 B2Brewer Science Inc.
- Flexographic printing plate and method for manufacturing same20 Nov 2025US 2025/0353316 A1FUJIFILM Corporation
- Component Carrier With Photoimageable Dielectric Layer and Structured Conductive Layer Being Used as a Mask for Selectively Exposing the Photoimageable Dielectric Layer With Electromagnetic Radiation13 Nov 2025US 2025/0349688 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Resist topcoat compositions and methods of forming patterns using the composition11 Sep 2025US 2025/0284196 A1Samsung SDI.Co., Ltd.
- Photosensitive resin laminate and application thereof6 Mar 2025US 2025/0076763 A1Chang Chun Plastics Co., Ltd.
- Method of forming patterns using resist underlayer composition18 Aug 2022US 2022/0260914 A1Samsung SDI.Co., Ltd.
Most cited
By later US patents
- Process for preparing an overcoated photopolymer printing plate125US 4,427,759 AE. I. Du Pont de Nemours and Company · 1984
- Method of forming images122US 4,849,320 ACiba-Geigy Corporation · 1989
- Process for the formation of an image95US 4,857,437 ACiba-Geigy Corporation · 1989
- Process for preparing an overcoated photopolymer printing plate78US 4,460,675 AE. I. Du Pont de Nemours and Company · 1984
- Light-sensitive mixture for producing positive or negative relief copies72US 5,070,001 AHoechst Aktiengesellschaft · 1991