Component carrier with a photoimageable dielectric layer and a structured conductive layer being used as a mask for selectively exposing the photoimageable dielectric layer with electromagnetic radiation

A method for manufacturing a component carrier, the method comprising:

• providing a layer stack comprising at least one component carrier material;
• forming a photoimageable dielectric layer structure on the layer stack;
• forming a spatial pattern of an electrically conductive layer structure on the photoimageable dielectric layer structure, wherein the spatial pattern comprises openings formed within the electrically conductive layer structure;
• exposing the photoimageable dielectric layer structure to electromagnetic radiation, wherein the spatial pattern of the electrically conductive layer structure represents a mask for selectively exposing predefined regions of the photoimageable dielectric layer structure;
• selectively removing material from the photoimageable dielectric layer depending on the spatial pattern,
• wherein at least one recess is formed by selectively removing material from the photoimageable dielectric layer depending on the spatial pattern of the electrically conductive layer structure;
• and
• forming an electrically conductive material within the at least one recess.