Bottom-up conformal coating and photopatterning on PAG-immobilized surfaces
AssigneeBrewer Science Inc.
InventorsJinhua Dai, Joyce A. Lowes, Carissa Jones
Life of this patent
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Abstract
Materials and methods to immobilize photoacid generators on semiconducting substrates are provided. PAG-containing monomers are copolymerized with monomers to allow the polymer to bind to a surface, and optionally copolymerized with monomers to enhance solubility to generate PAG-containing polymers. The PAG-containing monomers can be coated onto a surface, where the immobilized PAGs can then be used to pattern materials coated on top of the immobilized PAGs, allowing direct patterning without the use of a photoresist, thereby reducing process steps and cost. The disclosed materials and processes can be used to produce conformal coatings of controlled thicknesses.
Claims39
A method of forming a structure, said method comprising:
- applying an acid-generating composition on a substrate surface, or on one or more intermediate layers optionally present on said substrate surface, said acid-generating composition comprising a polymer including recurring monomers comprising an acid-generating group;
- heating said acid-generating composition to form an acid-generating layer having an average thickness of between 2 nm and 5 nm;
- applying an acid-sensitive composition on said acid-generating layer, said acid-sensitive composition comprising less than about 0.5% by weight total of acids, photoacid generators, and thermal acid generators, based upon the total weight of the composition taken as 100% by weight;
- heating said acid-sensitive composition to form an acid-sensitive layer;
- and
- exposing at least a portion of said acid-sensitive layer to radiation.
A microelectronic structure comprising:
- a substrate having a surface;
- one or more optional intermediate layers on said substrate surface;
- an acid-generating layer on said one or more optional intermediate layers, if present, or on said substrate surface, if no intermediate layers are present, said acid-generating layer having an average thickness of between 2 nm and 5 nm and comprising a polymer including recurring monomers comprising an acid-generating group;
- and
- an acid-sensitive layer on said acid-generating layer, said acid-sensitive layer comprising less than about 0.5% by weight total of acids, photoacid generators, and thermal acid generators, based upon the total weight of the acid-sensitive layer taken as 100% by weight.
A microelectronic structure comprising:
- a substrate having a surface;
- one or more optional intermediate layers on said substrate surface;
- an acid-generating layer on said one or more optional intermediate layers, if present, or on said substrate surface, if no intermediate layers are present, said acid-generating layer having an average thickness of between 2 nm and 5 nm and comprising:
- unexposed portions that comprise a first polymer including recurring monomers comprising an acid-generating group;
- and
- exposed portions that comprise a second polymer and an acid;
- and
- an acid-sensitive layer on said acid-generating layer, said acid-sensitive layer comprises:
- unexposed portions that comprise less than about 0.5% by weight total of acids, photoacid generators, and thermal acid generators, based upon the total weight of the unexposed portions taken as 100% by weight, and that have a first solubility in a photoresist developer and/or a photoresist solvent;
- and
- exposed portions that have a second solubility in the same photoresist developer and/or photoresist solvent, said second solubility being different than said first solubility of said unexposed portions.
Dependencies are inferred from the claim text.