G02B 6/4269
With heat sinks or radiation fins
Official title: {with heat sinks or radiation fins}
G02B6/4269 (With heat sinks or radiation fins) appears on 844 US grants and 1,004 published applications in this corpus.
Search patents in G02B- Granted patents
- 844
- Published applications
- 1,004
- Assignees
- 340
- Inventors
- 2,031
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 5 | 0 |
| 1994 | 4 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 5 | 0 |
| 1998 | 9 | 0 |
| 1999 | 5 | 0 |
| 2000 | 3 | 0 |
| 2001 | 5 | 4 |
| 2002 | 8 | 20 |
| 2003 | 19 | 32 |
| 2004 | 19 | 22 |
| 2005 | 23 | 25 |
| 2006 | 21 | 12 |
| 2007 | 18 | 5 |
| 2008 | 8 | 5 |
| 2009 | 6 | 8 |
| 2010 | 5 | 6 |
| 2011 | 8 | 11 |
| 2012 | 10 | 21 |
| 2013 | 17 | 25 |
| 2014 | 17 | 47 |
| 2015 | 30 | 32 |
| 2016 | 51 | 50 |
| 2017 | 51 | 55 |
| 2018 | 58 | 49 |
| 2019 | 57 | 65 |
| 2020 | 67 | 65 |
| 2021 | 55 | 68 |
| 2022 | 51 | 74 |
| 2023 | 49 | 72 |
| 2024 | 57 | 75 |
| 2025 | 52 | 83 |
| 2026 | 41 | 73 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Fiber connector bulkhead adapter with shroud for protecting high-power fiber6 Oct 2026US 12,754,385 B2nLIGHT, Inc.
- Optical module29 Sep 2026US 12,748,272 B2Sumitomo Electric Industries, Ltd.
- Enhanced optical module cooling with angled fins29 Sep 2026US 12,748,273 B2Ciena Corporation
- Optical transceiver with versatile positioning15 Sep 2026US 12,736,763 B2Samtec, Inc.
- Optical module15 Sep 2026US 12,736,764 B2InnoLight Technology (Suzhou) Ltd.
- Dual duplex belly-to-belly little connector (bblc) based optical connectors8 Oct 2026US 2026/0309946 A1II-Vi Delaware, Inc.
- Semiconductor Device and Method of Forming Fan-Out Wafer Level CPO with Through Silicon Conductive Via1 Oct 2026US 2026/0299219 A1STATS ChipPAC Pte. Ltd.
- Next generation fiber optic module1 Oct 2026US 2026/0299228 A1
- Thermal isolation of laser engines in high density opto-electronic interconnection assemblies1 Oct 2026US 2026/0302723 A1Aayuna Inc.
- System for enabling solderable optical interconnect with integrated assembly for high-speed data transfer24 Sep 2026US 2026/0287833 A1Lightspeed Photonics Pvt. Ltd.
Most cited
By later US patents
- Optical transmission terminal device160US 5,960,141 AFujitsu Limited · 1999
- Temperature stable solid-state laser package132US 5,181,214 AHarmonic Lightwaves, Inc. · 1993
- Small-scale optoelectronic package132US 6,910,812 B2Peregrine Semiconductor Corporation · 2005
- Optoelectronic assembly with alignment member106US 5,202,943 AInternational Business Machines Corporation · 1993
- Transceiver and interface for IC package105US 8,588,561 B2Samtec, Inc. · 2013