G01R 31/312
By capacitive methods
Official title: by capacitive methods
G01R31/312 (By capacitive methods) appears on 204 US grants and 163 published applications in this corpus.
Search patents in G01R- Granted patents
- 204
- Published applications
- 163
- Assignees
- 112
- Inventors
- 347
- Latest grant
- 30 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 5 | 0 |
| 1992 | 3 | 0 |
| 1993 | 3 | 0 |
| 1994 | 0 | 0 |
| 1995 | 8 | 0 |
| 1996 | 8 | 0 |
| 1997 | 5 | 0 |
| 1998 | 7 | 0 |
| 1999 | 4 | 0 |
| 2000 | 6 | 0 |
| 2001 | 4 | 7 |
| 2002 | 11 | 10 |
| 2003 | 3 | 4 |
| 2004 | 7 | 6 |
| 2005 | 9 | 15 |
| 2006 | 13 | 20 |
| 2007 | 19 | 15 |
| 2008 | 8 | 13 |
| 2009 | 10 | 3 |
| 2010 | 3 | 4 |
| 2011 | 5 | 10 |
| 2012 | 3 | 3 |
| 2013 | 1 | 4 |
| 2014 | 6 | 9 |
| 2015 | 6 | 6 |
| 2016 | 8 | 3 |
| 2017 | 7 | 2 |
| 2018 | 2 | 2 |
| 2019 | 0 | 2 |
| 2020 | 2 | 7 |
| 2021 | 5 | 2 |
| 2022 | 3 | 4 |
| 2023 | 5 | 4 |
| 2024 | 6 | 4 |
| 2025 | 0 | 3 |
| 2026 | 4 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Defect detection module30 Jun 2026US 12,669,539 B2Feng Chia University
- Test needle, test probe, and flying probe tester for testing printed circuit boards9 Jun 2026US 12,650,464 B2Atg Mycronic GmbH
- Testing of microelectronics device and method26 May 2026US 12,638,499 B2Nokomis, Inc.
- Methods and techniques for determining when a probe tip is proximate to or in contact with a sample surface28 Apr 2026US 12,613,272 B2Xallent, LLC
- Semiconductor doping characterization method using photoneutralization time constant of corona surface charge26 Nov 2024US 12,154,833 B2SEMILAB Semiconductor Physics Laboratory Co., Ltd.
- Contactless testing of interposers and silicon bridges30 Jul 2026US 2026/0219310 A1Advantest Corporation
- Method and apparatus for contactless inspection of a substrate6 Nov 2025US 2025/0341568 A1ASML Netherlands B. V.
- Defect detection module7 Aug 2025US 2025/0251448 A1Feng Chia University
- Detection panel for detecting light-emitting unit and detection device including thereof5 Jun 2025US 2025/0180641 A1Industrial Technology Research Institute
- Testing of microelectronics device and method12 Dec 2024US 2024/0410940 A1Nokomis, Inc.
Most cited
By later US patents
- Apparatus for non-conductively interconnecting integrated circuits using half capacitors233US 5,629,838 APolychip, Inc. · 1997
- Capacitively-coupled test probe153US 5,274,336 AHewlett-Packard Company · 1993
- Method and apparatus for non-conductively interconnecting integrated circuits118US 6,728,113 B1Polychip, Inc. · 2004
- Method and apparatus for establishing electrical contact between a wafer and a chuck95US 6,121,783 A2000
- Method and apparatus for testing of electrical interconnection networks87US 4,565,966 AKollmorgen Technologies Corporation · 1986