G01L 9/0073
Using a semiconductive diaphragm
Official title: {using a semiconductive diaphragm}
G01L9/0073 (Using a semiconductive diaphragm) appears on 661 US grants and 503 published applications in this corpus.
Search patents in G01L- Granted patents
- 661
- Published applications
- 503
- Assignees
- 276
- Inventors
- 1,141
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 3 | 0 |
| 1982 | 1 | 0 |
| 1983 | 6 | 0 |
| 1984 | 5 | 0 |
| 1985 | 9 | 0 |
| 1986 | 14 | 0 |
| 1987 | 5 | 0 |
| 1988 | 5 | 0 |
| 1989 | 16 | 0 |
| 1990 | 7 | 0 |
| 1991 | 11 | 0 |
| 1992 | 6 | 0 |
| 1993 | 9 | 0 |
| 1994 | 16 | 0 |
| 1995 | 14 | 0 |
| 1996 | 16 | 0 |
| 1997 | 12 | 0 |
| 1998 | 5 | 0 |
| 1999 | 12 | 0 |
| 2000 | 12 | 0 |
| 2001 | 8 | 3 |
| 2002 | 21 | 12 |
| 2003 | 20 | 12 |
| 2004 | 8 | 13 |
| 2005 | 18 | 16 |
| 2006 | 16 | 29 |
| 2007 | 17 | 23 |
| 2008 | 20 | 13 |
| 2009 | 15 | 19 |
| 2010 | 19 | 13 |
| 2011 | 10 | 14 |
| 2012 | 17 | 18 |
| 2013 | 18 | 20 |
| 2014 | 13 | 27 |
| 2015 | 23 | 32 |
| 2016 | 30 | 42 |
| 2017 | 33 | 37 |
| 2018 | 21 | 19 |
| 2019 | 29 | 18 |
| 2020 | 15 | 25 |
| 2021 | 18 | 26 |
| 2022 | 19 | 21 |
| 2023 | 25 | 27 |
| 2024 | 21 | 11 |
| 2025 | 14 | 6 |
| 2026 | 8 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Sensing system on chip and the manufacturing method thereof29 Sep 2026US 12,748,006 B2National Tsing Hua University
- Capacitive pressure sensor for detecting a pressure, comprising two pressure ranges, and production methods18 Aug 2026US 12,710,327 B2Robert Bosch GmbH
- MEMS pressure sensor11 Aug 2026US 12,704,427 B2MEI Micro, Inc.
- Pressure sensor and manufacturing method for the same7 Apr 2026US 12,596,043 B2InvenSense, Inc.
- Micromechanical component for a sensor and/or microphone device10 Mar 2026US 12,570,521 B2Robert Bosch GmbH
- Stress-decoupled micromechanical pressure sensor and method for the production thereof10 Sep 2026US 2026/0266678 A1
- Micromechanical component for a sensor device, microphone device and/or micro-loudspeaker device27 Aug 2026US 2026/0250121 A1
- Microelectromechanical pressure sensor25 Jun 2026US 2026/0177443 A1
- Capacitive microelectromechanical pressure transducer and related manufacturing process28 May 2026US 2026/0145928 A1STMicroelectronics International N. V.
- Pressure sensor device5 Mar 2026US 2026/0063491 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- System and method for the wireless sensing of physical properties322US 6,111,520 AGeorgia Tech Research Corporation · 2000
- Method of fabrication of a microstructure having an internal cavity302US 6,297,072 B1Interuniversitair Micro-Elktronica Centrum (IMEC VZW) · 2001
- System, method, and sensors for sensing physical properties298US 6,278,379 B1Georgia Tech Research Corporation · 2001
- Ultraminiature pressure sensor with addressable read-out circuit171US 5,113,868 AThe Regents of the University of Michigan · 1992
- Multipoint pressure-sensing catheter system167US 4,815,472 AThe Regents of the University of Michigan · 1989