G01L 19/0076
Using buried connections
Official title: {using buried connections}
G01L19/0076 (Using buried connections) appears on 56 US grants and 64 published applications in this corpus.
Search patents in G01L- Granted patents
- 56
- Published applications
- 64
- Assignees
- 50
- Inventors
- 137
- Latest grant
- 1 Oct 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 1 | 1 |
| 2009 | 1 | 2 |
| 2010 | 2 | 3 |
| 2011 | 2 | 2 |
| 2012 | 2 | 3 |
| 2013 | 1 | 6 |
| 2014 | 5 | 4 |
| 2015 | 3 | 7 |
| 2016 | 9 | 5 |
| 2017 | 5 | 4 |
| 2018 | 4 | 9 |
| 2019 | 4 | 6 |
| 2020 | 2 | 2 |
| 2021 | 5 | 2 |
| 2022 | 3 | 1 |
| 2023 | 2 | 2 |
| 2024 | 2 | 1 |
| 2025 | 0 | 1 |
| 2026 | 0 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Combined sensor1 Oct 2024US 12,104,973 B2Yazaki Corporation
- Leadless pressure sensors9 Jan 2024US 11,867,583 B2Honeywell International Inc.
- Pressure sensor assembly for use in implantable medical device including a substrate having via that extends through substrate along via axis between first major surface and second major surface of substrate15 Aug 2023US 11,725,995 B2Medtronic, Inc.
- Sensor device and method of manufacture7 Mar 2023US 11,600,559 B2Melexis Technologies SA
- Leadless pressure sensors6 Dec 2022US 11,519,800 B2Honeywell International Inc.
- Pressure sensor device, pressure sensor system, and method for manufacturing of the pressure sensor device8 Oct 2026US 2026/0309564 A1NXP USA, Inc.
- Pressure sensor24 Sep 2026US 2026/0287456 A1Murata Manufacturing Co., Ltd.
- Sensor chip24 Jul 2025US 2025/0237566 A1Beijing BOE Sensor Technology Co., Ltd.
- Sensor assembly with a full-bridge pressure sensor18 Jul 2024US 2024/0241004 A1TE Connectivity Solutions GmbH
- Leadless pressure sensors23 Mar 2023US 2023/0086677 A1Honeywell International Inc.
Most cited
By later US patents
- MEMS integrated pressure sensor devices and methods of forming same66US 9,040,334 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Capacitive sensor47US 7,353,711 B2Analog Devices, Inc. · 2008
- Transducer for use in harsh environments36US 7,538,401 B2Rosemount Aerospace Inc. · 2009
- Method for making a transducer25US 7,642,115 B2Rosemount Aerospace Inc. · 2010
- Covered sealed pressure transducers and method for making same24US 6,229,427 B1Kulite Semiconductor Products, Inc. · 2001