Sensor assembly with a full-bridge pressure sensor
AssigneeTE Connectivity Solutions GmbH
InventorsRamprasad Nambisan, Predrag Drljaca
Life of this patent
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Abstract
A sensor assembly includes a substrate having a first outer surface and a second outer surface opposite the first outer surface, a first die attached to the first outer surface and having a first diaphragm, a second die attached to the second outer surface and having a second diaphragm, and a full-bridge pressure sensor including a plurality of piezoresistive elements. A first subset of at least two of the plurality of piezoresistive elements is disposed on the first diaphragm and a second subset of at least two of the plurality of piezoresistive elements is disposed on the second diaphragm.
Claims20
A sensor assembly, comprising:
- a substrate having a first outer surface and a second outer surface opposite the first outer surface;
- a first die attached to the first outer surface and having a first diaphragm;
- a second die attached to the second outer surface and having a second diaphragm;
- and
- a full-bridge pressure sensor including a plurality of piezoresistive elements, a first subset of at least two of the plurality of piezoresistive elements is disposed on the first diaphragm and a second subset of at least two of the plurality of piezoresistive elements is disposed on the second diaphragm.
Dependencies are inferred from the claim text.