Sensor device and method of manufacture

A method of manufacturing a sensor device, the method comprising:

• providing a package having a first die-receiving subframe defining a first volume separated by a partition wall of the package from a second die-receiving subframe defining a second volume;
• disposing an elongate sensor element within the package, the elongate sensor element having a sensing region at a first end thereof and a second end distal from the first end, and the elongate sensor element extending from within the first volume so that the second end of the elongate sensor element extends into the partition wall, the elongate sensor element residing substantially in the first volume;
• and
• dispensing an encapsulant material into the second volume after disposing the elongate sensor element within the package, the encapsulant material being impeded from progressing into the first volume.