Leadless pressure sensors

A method of manufacturing a pressure sensor assembly, the method comprising:

• providing a sensor housing disposed on a substrate, an aperture being defined through the substrate;
• providing a pressure sensor supported on the top surface of the substrate within the sensor housing;
• disposing a media retention collar about an opening at a top end of the sensor housing;
• disposing one or more metallic barriers onto a bottom surface of the substrate circumferentially about the first aperture, the one or more metallic barriers being at least partially coated with a solder mask;
• and
• soldering, using the one or more metallic barriers, the substrate of the pressure sensor to a receiving circuit board.

A pressure sensor comprising:

• a substrate defining a first aperture therethrough;
• a sensor assembly supported on a top surface of the substrate and defining an inner volume;
• a media retention collar disposed about an opening at a top end of the sensor assembly;
• a pressure sense die defining a second aperture therethrough, the pressure sense die disposed on the top surface of the substrate such that the first and second apertures are at least partially aligned;
• a microelectro-mechanical systems (MEMS) sensor supported on the top surface of the substrate within the inner volume, the MEMS sensor comprising a deformable membrane and configured to measure a change in conductance related to deformation of the deformable membrane;
• an application-specific integrated circuit (ASIC) operably coupled to the MEMS sensor and configured to measure a pressure, a pressure change, or a differential pressure based upon at least the change in conductance;
• and
• one or more metallic barriers disposed on a bottom surface of the substrate circumferentially about the first aperture, the one or more metallic barriers being at least partially coated with a solder mask,
• wherein the one or more metallic barriers are configured to solder the substrate of the pressure sensor to a receiving circuit board and wherein the solder mask prevents or reduces matter flow past the one or more metallic barriers during or after soldering the substrate of the pressure sensor to the receiving circuit board.