G01B 2210/56
Measuring geometric parameters of semiconductor structures
Official title: Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
G01B2210/56 (Measuring geometric parameters of semiconductor structures) appears on 703 US grants and 845 published applications in this corpus.
Search patents in G01B- Granted patents
- 703
- Published applications
- 845
- Assignees
- 223
- Inventors
- 1,673
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 1 | 2 |
| 2004 | 2 | 2 |
| 2005 | 0 | 1 |
| 2006 | 3 | 2 |
| 2007 | 2 | 2 |
| 2008 | 3 | 4 |
| 2009 | 2 | 8 |
| 2010 | 5 | 12 |
| 2011 | 8 | 21 |
| 2012 | 14 | 26 |
| 2013 | 12 | 27 |
| 2014 | 29 | 39 |
| 2015 | 33 | 47 |
| 2016 | 33 | 44 |
| 2017 | 46 | 65 |
| 2018 | 59 | 57 |
| 2019 | 81 | 71 |
| 2020 | 78 | 71 |
| 2021 | 52 | 70 |
| 2022 | 60 | 69 |
| 2023 | 49 | 57 |
| 2024 | 49 | 53 |
| 2025 | 52 | 55 |
| 2026 | 28 | 39 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Multi-target design for in-situ analysis of semiconductor fabrication process29 Sep 2026US 12,751,240 B2APPLIED Materials.Inc.
- Height measurement sensor using derivative of periodic points22 Sep 2026US 12,742,636 B2ASML Netherlands B. V.
- Film thickness measuring device and film thickness measuring method22 Sep 2026US 12,742,637 B2Hamamatsu Photonics K.K.
- Methods and systems for model-less, scatterometry based measurements of semiconductor structures22 Sep 2026US 12,743,027 B2KLA Corporation
- In-situ wafer stress measurement by chromatic confocal sensor scanning with temperature compensation25 Aug 2026US 12,716,713 B2Orbotech Ltd.
- Full wafer thickness map reflectometry24 Sep 2026US 2026/0287327 A1GlobalWafers Co., Ltd.
- Second-harmonic generation for critical dimensional metrology24 Sep 2026US 2026/0287331 A1FemtoMetrix, Inc.
- Method of determining misalignment of semiconductor device24 Sep 2026US 2026/0287345 A1SK hynix Inc.
- Edge shape measurement apparatus and method of measuring edge shape10 Sep 2026US 2026/0266596 A1Fujikoshi Machinery Corp.
- Device and method for measuring positional displacement amount of laminated substrate, and semiconductor manufacturing device27 Aug 2026US 2026/0251446 A1Kobelco Research Institute, Inc.
Most cited
By later US patents
- System and method for optically measuring a structure261US 5,880,838 ACalifornia Institute of California · 1999
- Optimized spatial modeling for optical CD metrology89US 9,915,522 B1KLA-Tencor Corporation · 2018
- X-ray scatterometry metrology for high aspect ratio structures68US 10,352,695 B2KLA-Tencor Corporation · 2019
- Method and apparatus for measuring stress in semiconductor wafers67US 6,678,055 B2Tevet Process Control Technologies Ltd. · 2004
- Inspection apparatus for semiconductor packages47US 6,005,965 AKomatsu Ltd. · 1999