Device and method for measuring positional displacement amount of laminated substrate, and semiconductor manufacturing device

Abstract

A bonded substrates misalignment amount measurement device and method are for measuring a misalignment amount between two sorts of disc-shaped substrates having different diameter from one another and including a first substrate and a second substrate lying one on another in a thickness direction thereof. To do so, emit measurement light is emitted to the bonded substrates in the thickness direction to measure a transmission intensity distribution of the measurement light in a radial direction thereof, and a misalignment amount is calculated on the basis of a measurement result. The measurement light has a wavelength enabling transmission through the one of the first substrate and the second substrate that has a larger diameter. The bonded substrates misalignment amount measurement device is used for a semiconductor manufacturing apparatus.

Dependencies are inferred from the claim text.