C25D 21/12
Process control or regulation
Official title: Process control or regulation (controlling or regulating in general G05)
C25D21/12 (Process control or regulation) appears on 1,122 US grants and 1,446 published applications in this corpus.
Search patents in C25D- Granted patents
- 1,122
- Published applications
- 1,446
- Assignees
- 562
- Inventors
- 2,725
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 7 | 0 |
| 1978 | 8 | 0 |
| 1979 | 7 | 0 |
| 1980 | 4 | 0 |
| 1981 | 2 | 0 |
| 1982 | 3 | 0 |
| 1983 | 1 | 0 |
| 1984 | 9 | 0 |
| 1985 | 6 | 0 |
| 1986 | 3 | 0 |
| 1987 | 7 | 0 |
| 1988 | 5 | 0 |
| 1989 | 6 | 0 |
| 1990 | 4 | 0 |
| 1991 | 4 | 0 |
| 1992 | 9 | 0 |
| 1993 | 12 | 0 |
| 1994 | 8 | 0 |
| 1995 | 5 | 0 |
| 1996 | 2 | 0 |
| 1997 | 5 | 0 |
| 1998 | 6 | 0 |
| 1999 | 9 | 0 |
| 2000 | 20 | 0 |
| 2001 | 29 | 8 |
| 2002 | 24 | 31 |
| 2003 | 27 | 35 |
| 2004 | 35 | 47 |
| 2005 | 17 | 70 |
| 2006 | 14 | 42 |
| 2007 | 18 | 36 |
| 2008 | 23 | 27 |
| 2009 | 13 | 42 |
| 2010 | 27 | 37 |
| 2011 | 27 | 40 |
| 2012 | 24 | 45 |
| 2013 | 22 | 41 |
| 2014 | 26 | 60 |
| 2015 | 33 | 67 |
| 2016 | 48 | 64 |
| 2017 | 61 | 60 |
| 2018 | 53 | 86 |
| 2019 | 68 | 74 |
| 2020 | 55 | 68 |
| 2021 | 59 | 54 |
| 2022 | 50 | 96 |
| 2023 | 59 | 92 |
| 2024 | 63 | 106 |
| 2025 | 58 | 74 |
| 2026 | 32 | 44 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Plating apparatus and plating method15 Sep 2026US 12,735,799 B2Ebara Corporation
- Method for preparing anodic aluminum oxide-based photonic crystal product and anodic aluminum oxide-based photonic crystal product prepared thereby1 Sep 2026US 12,723,320 B2Jabil Circuit (Singapore) Pte. Ltd.
- Carbon fiber reinforced composites and method for making same18 Aug 2026US 12,709,816 B2UT-Battelle, LLC
- Plating apparatus and plating method28 Jul 2026US 12,692,617 B2Ebara Corporation
- Substrate holder, apparatus for plating, method of plating and storage medium28 Jul 2026US 12,692,618 B2Ebara Corporation
- Adjusting cathode temperature in electrodeposition8 Oct 2026US 2026/0308798 A1Lam Research Corporation
- Plating apparatus, control method for plating apparatus and nonvolatile storage medium storing program1 Oct 2026US 2026/0297791 A1Ebara Corporation
- Systems and methods for rinsing electroplating rotors24 Sep 2026US 2026/0286563 A1APPLIED Materials.Inc.
- Substrate sticking and breakage mitigation17 Sep 2026US 2026/0275564 A1Lam Research Corporation
- Substrate electroplating apparatus and method3 Sep 2026US 2026/0258575 A1ACM Research (Shanghai) Inc.
Most cited
By later US patents
- Electro-chemical deposition system333US 6,258,220 B1APPLIED Materials.Inc. · 2001
- Plating apparatus and method243US 6,391,166 B1ACM Research, Inc. · 2002
- Copper electroplating apparatus146US 6,527,920 B1Novellus Systems, Inc. · 2003
- Apparatus for controlling plating over a face of a substrate120US 6,042,712 AFormFactor, Inc. · 2000
- Method for electroplating metal films including use a cathode ring insulator ring and thief ring108US 5,744,019 AAIWA Research and Development, Inc. · 1998