C25D 21/14
Controlled addition of electrolyte components
C25D21/14 (Controlled addition of electrolyte components) appears on 238 US grants and 300 published applications in this corpus.
Search patents in C25D- Granted patents
- 238
- Published applications
- 300
- Assignees
- 165
- Inventors
- 728
- Latest grant
- 5 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 4 | 0 |
| 1993 | 4 | 0 |
| 1994 | 3 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 4 | 0 |
| 2000 | 4 | 0 |
| 2001 | 8 | 3 |
| 2002 | 8 | 6 |
| 2003 | 9 | 12 |
| 2004 | 4 | 9 |
| 2005 | 4 | 12 |
| 2006 | 3 | 7 |
| 2007 | 4 | 6 |
| 2008 | 2 | 1 |
| 2009 | 0 | 6 |
| 2010 | 2 | 10 |
| 2011 | 2 | 9 |
| 2012 | 4 | 12 |
| 2013 | 7 | 9 |
| 2014 | 5 | 11 |
| 2015 | 10 | 22 |
| 2016 | 13 | 15 |
| 2017 | 17 | 12 |
| 2018 | 11 | 22 |
| 2019 | 13 | 16 |
| 2020 | 13 | 17 |
| 2021 | 14 | 10 |
| 2022 | 10 | 19 |
| 2023 | 15 | 13 |
| 2024 | 12 | 25 |
| 2025 | 9 | 9 |
| 2026 | 5 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Low alpha-ray emission stannous oxide and method of producing the same5 May 2026US 12,617,694 B2Mitsubishi Materials Corporation
- Electroplating systems and methods with increased metal ion concentrations21 Apr 2026US 12,606,928 B2APPLIED Materials.Inc.
- Method of liquid management in anode chamber and apparatus for plating17 Mar 2026US 12,577,699 B2Ebara Corporation
- Plating apparatus and plating method10 Feb 2026US 12,546,026 B2Ebara Corporation
- Leveling compound control27 Jan 2026US 12,535,454 B2Lam Research Corporation
- Plating apparatus and plating solution discharging method16 Jul 2026US 2026/0201600 A1Ebara Corporation
- Method of liquid management in anode chamber and apparatus for plating11 Jun 2026US 2026/0159985 A1Ebara Corporation
- "Golden" - Gold Nanomaterials28 May 2026US 2026/0146355 A1AG-Nano System LLC
- Plating Device for Reduced-Pressure Plating Treatment And Reduced-Pressure Plating Treatment Method30 Apr 2026US 2026/0117413 A1Mitomo Semicon Engineering Co., Ltd.
- Plating device16 Apr 2026US 2026/0103818 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Copper metallization of silicon wafers using insoluble anodes83US 6,024,856 AEnthone-OMI, Inc. · 2000
- Automatic analyzer and control system for electroplating baths69US 4,326,940 ARohco, Inc. · 1982
- Apparatus and method for electroplating tin with insoluble anodes66US 6,251,255 B1Precision Process Equipment, Inc. · 2001
- PZT amorphous alloy plating solution and method for plating a PZT amorphous alloy using the same53US 9,909,225 B2Befs Co., Ltd. · 2018
- Apparatus to monitor and add plating solution of plating baths and controlling quality of deposited metal52US 6,113,769 AInternational Business Machines Corporation · 2000