Plating device

A plating device comprising:

• a first plating cell comprising a plating tank and a housing surrounding the plating tank, wherein the plating tank is configured to contain a volume of electrolyte, and wherein the plating cell is configured such that a wafer can be immersed within the electrolyte in the plating tank;
• a second plating cell at a different level than the first plating cell;
• an electrolyte chamber below the first plating cell and the second plating cell and configured to accommodate electrolyte discharged from the first plating cell and the second plating cell;
• a first connection part in fluid communication with the first plating cell and the electrolyte chamber so that the electrolyte discharged from the first plating cell flows to the electrolyte chamber;
• a second connection part in fluid communication with the second plating cell and the electrolyte chamber so that the electrolyte discharged from the second plating cell flows to the electrolyte chamber;
• and
• a resupply part configured to resupply the first plating cell and the second plating cell with electrolyte from the electrolyte chamber,
• wherein at least one of the first connection part and the second connection part comprises:
• a first pipe through which the electrolyte flows at a first flow rate;
• and
• a second pipe downstream of the first pipe and through which the electrolyte flows at a second flow rate lower than the first flow rate.

A plating device comprising:

• a first plating cell comprising a plating tank and a housing surrounding the plating tank, wherein the plating tank is configured to contain a volume of electrolyte, and wherein the plating cell is configured such that a wafer can be immersed within the electrolyte in the plating tank;
• a second plating cell at a different level than the first plating cell;
• an electrolyte chamber below the first plating cell and the second plating cell and configured to accommodate electrolyte discharged from the first plating cell and the second plating cell;
• a first connection part in fluid communication with the first plating cell and the electrolyte chamber so that the electrolyte discharged from the first plating cell flows to the electrolyte chamber;
• a second connection part in fluid communication with the second plating cell and the electrolyte chamber so that the electrolyte discharged from the second plating cell flows to the electrolyte chamber;
• and
• a resupply part configured to resupply the first plating cell and the second plating cell with electrolyte from the electrolyte chamber,
• wherein at least one of the first connection part and the second connection part comprises:
• a first pipe through which the electrolyte flows at a first flow rate;
• and
• a second pipe downstream of the first pipe and through which the electrolyte flows at a second flow rate lower than the first flow rate, and
• wherein the first pipe and the second pipe are oriented in a same direction, wherein the second pipe extends from a lower end portion of the first pipe, wherein an end portion of the second pipe from which the electrolyte is discharged is immersed in the electrolyte in the electrolyte chamber, and wherein a cross-sectional area of the second pipe is smaller than a cross-sectional area of the first pipe.