Plating Device for Reduced-Pressure Plating Treatment And Reduced-Pressure Plating Treatment Method

A plating equipment for vacuum plating treatment, the plating equipment comprising:

• a plating tank including an opening portion, a solution supply section, and a solution discharge section, the opening portion including a seal configured to prevent leakage of a plating solution when an object to be plated is placed, the plating solution being supplied from the solution supply section, the plating solution being discharged from the solution discharge section;
• a rotating unit configured to rotate the plating tank itself;
• an in-tank decompression unit configured to decompress in an in-tank space formed by a surface to be plated of the object to be plated placed at the opening portion and the plating tank;
• and
• an object-to-be-plated back surface press cover including a back surface decompression unit configured to press a peripheral edge of the object to be plated placed at the opening portion to decompress in a back space formed on a back surface side of the object to be plated, being a rear surface of the surface to be plated, wherein the in-tank decompression unit includes a decompression pocket, a decompression pipe, and a solution discharge pipe, the decompression pocket being, when the object to be plated is brought into an inclined posture by rotating the plating tank, provided on an inner wall of the plating tank at a position located at an upper portion in the inclined posture, the decompression pipe being connected to an exhaust port of the decompression pocket, the solution discharge pipe being provided for discharging the plating solution remaining in the decompression pipe, and
• the decompression pipe extends from the decompression pocket in a direction toward a center of the plating tank.