"Golden" - Gold Nanomaterials

Abstract

A method and system for electroplating “Golden” gold nanoparticles (Nano-Au25) are disclosed. The process employs sequential substrate preparation, nickel and gold strike deposition, followed by formation of a reduced-thickness gold layer and a nanoparticle layer produced from a gold phosphate electrolyte containing sodium borohydride. The deposition is carried out at a pH of 12-14 and a temperature of 140-160° F., achieving a rate of 3-4 μm/h under controlled current density. A feedback-controlled electroplating apparatus monitors pH, temperature, and current in real time to ensure uniform nanoparticle growth. The resulting dual-layer coating provides enhanced conductivity, durability, and material efficiency while maintaining compliance with industry gold-plating standards, rendering it suitable for high-performance electronic connectors and semiconductor applications.

Dependencies are inferred from the claim text.