Substrate holder, apparatus for plating, method of plating and storage medium

A substrate holder configured to hold a substrate and cause the substrate to come into contact with a plating solution and to be plated, the substrate holder comprising:

• an internal space configured to place an outer circumferential portion of the substrate therein such as to be sealed from outside of the substrate holder, in a state that the substrate is held by the substrate holder;
• a detector placed in the internal space and configured to monitor an electric current flowing in a liquid or an electric resistance of the liquid during plating in a state that the liquid is introduced into the internal space and thereby detect a leakage of the plating solution to the internal space;
• and
• a contact placed in the internal space and configured to come into contact with a seed layer formed on a surface of the substrate and to make a flow of plating current to the substrate, wherein
• the detector has an insoluble electrode, and
• the detector is configured to apply an AC voltage between the insoluble electrode and the contact or a wiring electrically connected with the contact, in a state that the liquid is introduced into the internal space, and monitor an electric current flowing in the insoluble electrode, so as to detect a leakage of the plating solution to the internal space.

A method of plating a substrate, the method comprising:

• introducing a liquid into an internal space of a substrate holder that is configured to place an outer circumferential portion of the substrate therein such as to be sealed from outside, the substrate holder comprising:
• a contact placed in the internal space and configured to come into contact with a seed layer formed on a surface of the substrate and to make a flow of plating current to the substrate, and a soluble electrode biased to a higher potential side relative to the contact;
• and
• monitoring an electric current flowing in the liquid or an electric resistance of the liquid in a state that the liquid is introduced into the internal space and thereby detecting a leakage of a plating solution to the internal space, wherein an electric current flowing between the soluble electrode and the contact or a wiring electrically connected with the contact is monitored in a state that the liquid is introduced into the internal space, and thereby to detect a leakage of the plating solution to the internal space.

A substrate holder configured to hold a substrate and cause the substrate to come into contact with a plating solution and to be plated, the substrate holder comprising:

• an internal space configured to place an outer circumferential portion of the substrate therein such as to be sealed from outside of the substrate holder, in a state that the substrate is held by the substrate holder;
• a contact placed in the internal space and configured to come into contact with a seed layer formed on a surface of the substrate and to make a flow of plating current to the substrate in a state that a liquid is introduced into the internal space;
• and
• a soluable electrode placed in the internal space and biased to a higher potential side relative to the contact.

A method of plating a substrate, the method comprising:

• introducing a liquid into an internal space of a substrate holder that is configured to place an outer circumferential portion of the substrate therein such as to be sealed from outside, the substrate holder comprising:
• a contact placed in the internal space and configured to come into contact with a seed layer formed on a surface of the substrate and to make a flow of plating current to the substrate, and a soluble electrode biased to a higher potential side relative to the contact;
• and
• biasing the soluble electrode placed in the internal space to a higher potential side relative to the contact that is configured to make a flow of plating current to the substrate, in a state that the liquid is introduced into the internal space, so as to suppresses corrosion of a seed layer formed on a surface of the substrate.

A method of plating a substrate, the method comprising:

• introducing a liquid into an internal space of a substrate holder that is configured to place an outer circumferential portion of the substrate therein such as to be sealed from outside, the substrate holder comprising:
• a contact placed in the internal space and configured to come into contact with a seed layer formed on a surface of the substrate and to make a flow of plating current to the substrate, and an insoluble electrode;
• and
• monitoring an electric current flowing in the liquid or an electric resistance of the liquid in a state that the liquid is introduced into the internal space and thereby detecting a leakage of a plating solution to the internal space, wherein an AC voltage is applied between the insoluble electrode and the contact or a wiring electrically connected with the contact, and an electric current flowing in the insoluble electrode is monitored, so as to detect a leakage of the plating solution to the internal space.