Plating apparatus and plating method

A plating apparatus for plating a substrate by making electric current flow from an anode to the substrate, the plating apparatus comprising:

• plural anode-side electric wires which are electrically connected to the anode via plural electric contacts on the anode;
• plural substrate-side electric wires which are electrically connected to the substrate via plural electric contacts on the substrate;
• plural variable resistors positioned, in at least one of the anode side and the substrate side, in middle positions in the plural anode-side electric wires or the plural substrate-side electric wires;
• and
• a controller configured to adjust each of resistance values of the plural variable resistors, wherein the controller is configured to:
• determine each of the resistance values of the plural variable resistors by using a machine learning model, wherein input to the machine learning model is plated film thickness at respective points on the substrate, and output from the machine learning model is the respective resistance values of the respective variable resistors, and
• set the determined resistance values to the plural variable resistors, respectively, and make the plating apparatus perform a plating process,
• wherein the input of the machine learning model further comprises at least one of:
• electric conduction time during which electric current is made to flow between the anode and the substrate, an opening area of the substrate, or an opening ratio of the substrate.