C25D 21/08
Rinsing
C25D21/08 (Rinsing) appears on 94 US grants and 111 published applications in this corpus.
Search patents in C25D- Granted patents
- 94
- Published applications
- 111
- Assignees
- 59
- Inventors
- 286
- Latest grant
- 7 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 1 |
| 2002 | 0 | 0 |
| 2003 | 1 | 3 |
| 2004 | 3 | 5 |
| 2005 | 0 | 1 |
| 2006 | 1 | 0 |
| 2007 | 2 | 3 |
| 2008 | 1 | 1 |
| 2009 | 0 | 3 |
| 2010 | 1 | 1 |
| 2011 | 2 | 3 |
| 2012 | 3 | 4 |
| 2013 | 2 | 1 |
| 2014 | 0 | 2 |
| 2015 | 2 | 2 |
| 2016 | 2 | 5 |
| 2017 | 2 | 4 |
| 2018 | 3 | 10 |
| 2019 | 5 | 10 |
| 2020 | 4 | 3 |
| 2021 | 3 | 1 |
| 2022 | 8 | 5 |
| 2023 | 6 | 14 |
| 2024 | 7 | 14 |
| 2025 | 8 | 9 |
| 2026 | 6 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for cleaning electroplating device7 Jul 2026US 12,674,247 B2ACM Research (Shanghai) Inc.
- Plating apparatus12 May 2026US 12,624,472 B2Ebara Corporation
- Plating apparatus and substrate cleaning method21 Apr 2026US 12,606,929 B2Ebara Corporation
- Electroplating system including an improved base structure31 Mar 2026US 12,590,381 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Plating apparatus10 Mar 2026US 12,571,120 B2Tokyo Electron Limited
- Systems and methods for rinsing electroplating rotors24 Sep 2026US 2026/0286563 A1APPLIED Materials.Inc.
- Plating apparatus and substrate cleaning method23 Jul 2026US 2026/0209984 A1Ebara Corporation
- Vibration attenuation control method and apparatus for electroplating equipment, and electronic equipment16 Jul 2026US 2026/0201599 A1ACM Research (Shanghai) Inc.
- Plating apparatus and plating solution discharging method16 Jul 2026US 2026/0201600 A1Ebara Corporation
- Electroplating system including an improved base structure25 Jun 2026US 2026/0176789 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Electroplating chamber with rotatable wafer holder and pre-wetting and rinsing capability158US 6,099,702 ANovellus Systems, Inc. · 2000
- In-situ cleaning processes for semiconductor electroplating electrodes34US 6,599,412 B1Semitool, Inc. · 2003
- Multi-chemistry plating system32US 7,223,323 B2APPLIED Materials.Inc. · 2007
- Rapidly cleanable electroplating cup assembly27US 7,935,231 B2Novellus Systems, Inc. · 2011
- Counterflow spray rinse process25US 4,654,089 A1987