Plating apparatus

A plating apparatus comprising:

• a plating tank configured to house a plating solution;
• a substrate holder configured to hold a substrate with a surface to be plated facing downward, the substrate holder including a contact member for feeding power to the substrate;
• a contact cleaning member for discharging a cleaning liquid to the contact member while the contact cleaning member is at a cleaning position between the plating tank and the substrate holder;
• a driving mechanism configured to move the contact cleaning member between the cleaning position and a retracted position retracted from between the plating tank and the substrate holder;
• a nozzle cleaning cover configured to cover an upper portion of the contact cleaning member while the contact cleaning member is at the retracted position,
• a tray member configured to house the contact cleaning member, the tray member being configured to receive the cleaning liquid that has dropped after being discharged from the contact cleaning member;
• and
• a fixed tray member arranged at the retracted position, the fixed tray member being configured to receive the cleaning liquid from the tray member, the cleaning liquid having dropped to the tray member, wherein
• the driving mechanism is configured to move the tray member between the cleaning position and the retracted position, and
• the nozzle cleaning cover is mounted to the fixed tray member,
• wherein the plating apparatus further comprises:
• a coupling member configured to couple the fixed tray member and a drain tube, wherein
• the coupling member includes a first flow passage, a second flow passage, and a third flow passage, the first flow passage extends from an opening formed in a bottom wall of the fixed tray member in a downward direction, the second flow passage extends from the drain tube in an upward direction, the third flow passage communicates between a bottom portion of the first flow passage and a top portion of the second flow passage, and the bottom portion of the first flow passage is at a position lower than the top portion of the second flow passage.