Method for cleaning electroplating device

A method for cleaning an electroplating device, the electroplating device comprising an electroplating chamber having a cathode chamber and an anode chamber, a liquid inlet channel being arranged in a sidewall of the anode chamber for supplying liquid to the cathode chamber, the method comprising the following steps:

• providing a partition, which is installed between the cathode chamber and the anode chamber to separate the cathode chamber and the anode chamber;
• supplying cleaning solution into the cathode chamber to clean the cathode chamber;
• supplying cleaning solution into the anode chamber to clean the anode chamber;
• after the cathode chamber and the anode chamber are cleaned, draining the cleaning solution in the cathode chamber and the anode chamber through their respective liquid outlets;
• removing the partition from between the cathode chamber and the anode chamber;
• providing a first exhaust pipe having two ends, one end of the first exhaust pipe being placed into the liquid inlet channel arranged in the sidewall of the anode chamber, the other end of the first exhaust pipe being connected to a first pump, draining the cleaning solution in the liquid inlet channel through the first pump;
• providing a second exhaust pipe having two ends, one end of the second exhaust pipe being placed into the anode chamber, the other end of the second exhaust pipe being connected to a second pump, draining the cleaning solution in the anode chamber through the second pump.