Rapidly cleanable electroplating cup assembly

A closed-contact electroplating cup, comprising:

• a cup bottom comprising an opening;
• a seal disposed on the cup bottom around the opening, the seal comprising a fluid shedding structure extending diagonally upward and outward from an inner edge of the cup bottom;
• an electrical contact assembly comprising an electrically conductive ring and a plurality of contacts extending inwardly from the ring and diagonally out of the plane of the ring over the fluid shedding structure of the seal;
• and
• a ring-shaped bus bar positioned over and in contact with the electrically conductive ring, the bus bar comprising a diagonally sloped surface on an interior side of the bus bar.

An electrical contact structure for an electroplating cup, comprising:

• an electrically conductive outer ring;
• a plurality of contacts extending inwardly toward a center of the outer ring and diagonally outwardly from a plane of the outer ring, wherein each contact comprises a wafer contacting surface proximate an end of the wafer contact;
• and
• one or more tabs coupled to and extending upwardly from a central portion of the outer ring.

A seal configured to seal an opening in a closed-contact electroplating cup when a wafer is positioned over the opening and in contact with the seal, the seal comprising:

• a sealing structure extending upwardly from an inner edge of the seal;
• a fluid shedding surface extending diagonally upwardly and outwardly relative to the sealing structure;
• and
• a groove configured to accommodate a stiffening ring.