Electroplating system including an improved base structure

A method of manufacturing a base structure in an electroplating system comprising:

• providing an annular member;
• attaching a contact ring capable of being electrically connected to a wafer in an electroplating process to an inner surface of the annular member;
• attaching a pair of shield structures, extending in a vertical direction, to an upper surface of the annular member;
• forming a plurality of discharging openings in a curved plate of each of the shield structures;
• and
• forming a plurality of bevels, corresponding to the plurality of discharging openings, respectively, in the curved plate of each of the shield structures.

A base structure of an electroplating system, the base structure comprising:

• an annular member having an inner surface, an upper surface;
• a contact ring attached to the inner surface of the annular member and operable to be electrically connected to a wafer during an electroplating process;
• and
• at least one shield structure attached to the upper surface of the annular member and extending in a vertical direction, each of the at least one shield structure comprising:
• a curved plate comprising a plurality of discharging openings operable to discharge plating solution residual through the plurality of discharging openings during a cleaning procedure;
• and
• a plurality of bevels, each of the plurality of bevels corresponding to one of the plurality of discharging openings and operable to guide the plating solution residual toward the corresponding discharging opening in the cleaning procedure.