C25D 21/04
Removal of gases or vapours
Official title: Removal of gases or vapours {; Gas or pressure control}
C25D21/04 (Removal of gases or vapours) appears on 154 US grants and 193 published applications in this corpus.
Search patents in C25D- Granted patents
- 154
- Published applications
- 193
- Assignees
- 116
- Inventors
- 415
- Latest grant
- 2 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 1 |
| 2002 | 0 | 3 |
| 2003 | 4 | 6 |
| 2004 | 2 | 10 |
| 2005 | 1 | 4 |
| 2006 | 3 | 4 |
| 2007 | 4 | 1 |
| 2008 | 3 | 4 |
| 2009 | 2 | 3 |
| 2010 | 5 | 7 |
| 2011 | 4 | 7 |
| 2012 | 1 | 4 |
| 2013 | 5 | 7 |
| 2014 | 4 | 6 |
| 2015 | 3 | 11 |
| 2016 | 6 | 9 |
| 2017 | 10 | 4 |
| 2018 | 5 | 14 |
| 2019 | 10 | 11 |
| 2020 | 8 | 6 |
| 2021 | 8 | 5 |
| 2022 | 4 | 18 |
| 2023 | 12 | 16 |
| 2024 | 11 | 13 |
| 2025 | 7 | 11 |
| 2026 | 6 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Plating apparatus2 Jun 2026US 12,644,198 B2Ebara Corporation
- Plating method and plating apparatus19 May 2026US 12,630,939 B2Ebara Corporation
- Equipment for continuously processing electrochemical device or component for increasing capacity28 Apr 2026US 12,614,714 B2Forschungszentrum Julich GmbH
- Electroplating systems and methods with increased metal ion concentrations21 Apr 2026US 12,606,928 B2APPLIED Materials.Inc.
- Method of processing articles and corresponding apparatus14 Apr 2026US 12,601,082 B2STMicroelectronics S,r.l.
- Substrate processing apparatus27 Aug 2026US 2026/0250876 A1Ebara Corporation
- Plating method and plating apparatus27 Aug 2026US 2026/0250877 A1Ebara Corporation
- Plating apparatus and plating solution discharging method16 Jul 2026US 2026/0201600 A1Ebara Corporation
- Method of liquid management in anode chamber and apparatus for plating11 Jun 2026US 2026/0159985 A1Ebara Corporation
- Plating Device for Reduced-Pressure Plating Treatment And Reduced-Pressure Plating Treatment Method30 Apr 2026US 2026/0117413 A1Mitomo Semicon Engineering Co., Ltd.
Most cited
By later US patents
- Apparatus for electroplating a semiconductor substrate62US 5,853,559 AMitsubishi Denki Kabushiki Kaisha · 1998
- Method and associated apparatus for tilting a substrate upon entry for metal deposition45US 6,582,578 B1APPLIED Materials.Inc. · 2003
- Apparatus for the treatment of board-like articles, particularly printed circuit boards31US 5,335,681 AGebr. Schmid GmbH & Co. · 1994
- Plating apparatus and method26US 7,402,227 B2Ebara Corporation · 2008
- Electrolyte loop with pressure regulation for separated anode chamber of electroplating system23US 8,603,305 B2Novellus Systems, Inc. · 2013