Method and associated apparatus for tilting a substrate upon entry for metal deposition

A method of immersing a plating surface formed on a substrate into electrolyte solution, the method comprising:

• positioning the substrate at an angle from horizontal above the electrolyte solution;
• maintaining electrolyte solution within an electrolyte solution cell;
• and
• vertically displacing the substrate to immerse the plating surface into the electrolyte solution while maintaining the substrate at an angle from horizontal, wherein at least a portion of seed layer on the substrate contacts the electrolyte solution during said immersion.

An apparatus for electroplating comprising:

• a cell;
• a substrate holder assembly configured to hold a substrate either in a substantially horizontal position or a tilted position;
• and
• an actuator that is configured to displace the substrate holder assembly in the x-direction, the z-direction, and tilt the substrate holder.

An apparatus for electroplating, comprising:

• a plating cell configured to contain an electrolyte therein;
• a substrate holder assembly configured to hold a substrate having a plating surface;
• and
• a controller programmed to control immersion of the plating surface into the electrolyte by positioning the substrate at an angle from horizontal above the electrolyte and vertically displacing the plating surface into the electrolyte while maintaining the substrate at an angle from horizontal.

An apparatus for electroplating comprising:

• a cell;
• a substrate holder assembly configured to hold a substrate in one of a substantially horizontal position and a tilted position;
• and
• an actuator configured to displace the substrate holder assembly in one of an x-direction and a z-direction, and to vertically displace the substrate into the cell in the tilted position.