Substrate processing apparatus

Abstract

A substrate processing apparatus that can efficiently clean the inside of the apparatus is achieved. A plating apparatus includes a substrate transfer chamber (701), a fan filter unit (408), a plating chamber (401), an exhaust chamber (702), a partition member (720), and a bypass flow channel (730). The substrate transfer chamber (701) houses a transfer device for transferring a substrate. The fan filter unit (408) is disposed above the substrate transfer chamber (701) and configured to supply a gas to the substrate transfer chamber (701). The plating chamber (401) is disposed on a side of the substrate transfer chamber (701) and houses a plating module (400) for performing a plating process on the substrate. The exhaust chamber (702) is disposed below the substrate transfer chamber (701). The partition member (720) is disposed between the substrate transfer chamber (701) and the exhaust chamber (702). The substrate transfer chamber (701) and the exhaust chamber (702) communicate through the bypass flow channel (730) by bypassing the partition member (720). The plating chamber (401) has a supply port (404) for supplying the gas supplied to the substrate transfer chamber (701) by the fan filter unit (408) to the plating chamber (401), and a discharge port (405) for discharging the gas supplied to the plating chamber (401) to outside. The exhaust chamber (702) has an exhaust outlet (703) for discharging the gas supplied to the exhaust chamber (702) via the bypass flow channel (730) to outside.

Dependencies are inferred from the claim text.