C23F 1/08
Apparatus
Official title: Apparatus, e.g. for photomechanical printing surfaces (photo- mechanical reproduction G03F)
C23F1/08 (Apparatus) appears on 319 US grants and 251 published applications in this corpus.
Search patents in C23F- Granted patents
- 319
- Published applications
- 251
- Assignees
- 192
- Inventors
- 706
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 6 | 0 |
| 1978 | 7 | 0 |
| 1979 | 3 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 6 | 0 |
| 1983 | 7 | 0 |
| 1984 | 3 | 0 |
| 1985 | 9 | 0 |
| 1986 | 6 | 0 |
| 1987 | 3 | 0 |
| 1988 | 9 | 0 |
| 1989 | 6 | 0 |
| 1990 | 9 | 0 |
| 1991 | 18 | 0 |
| 1992 | 2 | 0 |
| 1993 | 4 | 0 |
| 1994 | 5 | 0 |
| 1995 | 4 | 0 |
| 1996 | 6 | 0 |
| 1997 | 5 | 0 |
| 1998 | 5 | 0 |
| 1999 | 5 | 0 |
| 2000 | 5 | 0 |
| 2001 | 7 | 2 |
| 2002 | 6 | 6 |
| 2003 | 5 | 7 |
| 2004 | 5 | 6 |
| 2005 | 7 | 11 |
| 2006 | 3 | 4 |
| 2007 | 2 | 6 |
| 2008 | 3 | 9 |
| 2009 | 3 | 5 |
| 2010 | 1 | 9 |
| 2011 | 8 | 14 |
| 2012 | 5 | 14 |
| 2013 | 11 | 13 |
| 2014 | 11 | 17 |
| 2015 | 10 | 22 |
| 2016 | 14 | 9 |
| 2017 | 12 | 13 |
| 2018 | 10 | 12 |
| 2019 | 9 | 9 |
| 2020 | 7 | 6 |
| 2021 | 8 | 10 |
| 2022 | 3 | 10 |
| 2023 | 5 | 8 |
| 2024 | 4 | 10 |
| 2025 | 12 | 9 |
| 2026 | 3 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Substrate processing apparatus and substrate processing method18 Aug 2026US 12,713,865 B2Tokyo Electron Limited
- Substrate treating apparatus and substrate treating method7 Apr 2026US 12,595,567 B2Semes Co., Ltd.
- Substrate processing apparatus and substrate processing method20 Jan 2026US 12,529,149 B2Semes Co., Ltd.
- Substrate processing method30 Dec 2025US 12,508,623 B2SCREEN Holdings Co., Ltd.
- Etching device9 Dec 2025US 12,492,479 B2Contemporary Amperex Technology (Hong Kong) Limited
- A system for use in processing a plurality of bodies of polycrystalline diamond material30 Jul 2026US 2026/0216617 A1Element Six (UK) Limited
- Method of processing a body of polycrystalline diamond material30 Jul 2026US 2026/0217619 A1Element Six (UK) Limited
- A method for processing a body of polycrystalline diamond material30 Jul 2026US 2026/0218385 A1Element Six (UK) Limited
- Method of processing a plurality of bodies of polycrystalline diamond material30 Jul 2026US 2026/0218386 A1Element Six (UK) Limited
- Apparatus for use in processing a body of polycrystalline diamond material23 Jul 2026US 2026/0209951 A1Element Six (UK) Limited
Most cited
By later US patents
- Method for treatment of deposition reactor520US 9,228,259 B2ASM IP Holding B. V. · 2016
- Etchant mixing system for edge bevel removal of copper from silicon wafers407US 6,333,275 B1Novellus Systems, Inc. · 2001
- Modulating etch selectivity and etch rate of silicon nitride thin films280US 8,187,486 B1Novellus Systems, Inc. · 2012
- VLSI chemical reactor143US 4,544,446 AJ. T. Baker Chemical Company · 1985
- Edge bevel removal of copper from silicon wafers92US 6,309,981 B1Novellus Systems, Inc. · 2001