Substrate treating apparatus and substrate treating method

A substrate treating apparatus comprising:

• a support unit comprising a support chuck and a support pin including an upper and a lower surface, the support unit configured to support and rotate a substrate;
• a liquid supply unit including a nozzle, the nozzle configured to supply a treatment liquid to the substrate supported by the support unit;
• a heating unit including a laser configured to irradiate laser light to a pattern on the substrate, to which the treatment liquid is applied;
• a camera module comprising an image sensor, a lighting source, and optical elements configured to monitor a point to which the laser light is irradiated;
• an error-identifying unit including a coordinate plate positioned at substantially the same height as an upper surface of the substrate supported by the support pin and having a target mark, the error-identifying unit being configured to verify a targeting accuracy of the laser light prior to substrate processing;
• and
• a controller configured to coordinate operation of the camera module and the laser,
• wherein a plurality of reference marks are formed on the substrate,
• wherein the camera module acquires actual locations of, among the plurality of reference marks, at least three reference marks of the plurality of reference marks, and derives an actual location of the pattern through the actual locations of the reference marks, and
• wherein the laser irradiates the laser light to the actual location of the pattern on the substrate, and
• wherein the substrate has a rectangular shape, and wherein the plurality of reference marks are formed at respective different corner areas of the substrate.