C23C 22/63
Treatment of copper or alloys based thereon
C23C22/63 (Treatment of copper or alloys based thereon) appears on 75 US grants and 46 published applications in this corpus.
Search patents in C23C- Granted patents
- 75
- Published applications
- 46
- Assignees
- 60
- Inventors
- 188
- Latest grant
- 15 Jul 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 3 | 0 |
| 1991 | 4 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 4 | 0 |
| 1997 | 3 | 0 |
| 1998 | 4 | 0 |
| 1999 | 5 | 0 |
| 2000 | 3 | 0 |
| 2001 | 4 | 2 |
| 2002 | 1 | 0 |
| 2003 | 1 | 3 |
| 2004 | 2 | 1 |
| 2005 | 0 | 3 |
| 2006 | 1 | 2 |
| 2007 | 1 | 2 |
| 2008 | 0 | 2 |
| 2009 | 2 | 0 |
| 2010 | 0 | 1 |
| 2011 | 1 | 1 |
| 2012 | 1 | 0 |
| 2013 | 1 | 1 |
| 2014 | 0 | 4 |
| 2015 | 3 | 2 |
| 2016 | 2 | 4 |
| 2017 | 2 | 3 |
| 2018 | 2 | 3 |
| 2019 | 4 | 1 |
| 2020 | 1 | 4 |
| 2021 | 2 | 2 |
| 2022 | 0 | 0 |
| 2023 | 1 | 2 |
| 2024 | 1 | 1 |
| 2025 | 4 | 1 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Photothermal evaporator for a desalination system and method of manufacture15 Jul 2025US 12,357,923 B2Northeastern University
- Post-plating treatment method for one-step brass-electroplated steel wire29 Apr 2025US 12,286,723 B2Jiangsu Xingda Steel Tyre Cord Co., Ltd.
- Patinated or patina-ready metal transaction cards and manufacturing processes28 Jan 2025US 12,208,599 B2CompoSecure, LLC
- Fastener member7 Jan 2025US 12,188,131 B2YKK Corporation
- Passivation of copper-nickel alloy conduits for marine use10 Sep 2024US 12,084,775 B1The United States of America as represented by the Secretary of the Navy
- Method for manufacturing a surface-modified substrate using liquid metal and a surface-modified substrate manufactured by the method for manufacturing the same18 Jun 2026US 2026/0168103 A1University-Industry Cooperation Group of Kyung Hee University
- Copper surface passivation composition, use thereof, and photoresist stripper containing same5 Jun 2025US 2025/0180997 A1Zhejiang Aufirst Material Technology Co., Ltd.
- Method for manufacturing laminate30 May 2024US 2024/0179848 A1Namics Corporation
- Photothermal evaporator for a desalination system and method of manufacture26 Oct 2023US 2023/0338870 A1Northeastern University Center for Research Innovation, Northeastern Univ.
- Post-plating treatment method for one-step brass-electroplated steel wire6 Jul 2023US 2023/0212774 A1Jiangsu Xingda Steel Tyre Cord Co., Ltd.
Most cited
By later US patents
- Method of bonding copper and resin81US 4,642,161 AHitachi, Ltd. · 1987
- Process for treating copper surface74US 4,902,551 AHitachi Chemical Company, Ltd. · 1990
- Process for producing copper clad laminate72US 5,382,333 AMitsubishi Gas Chemical Company, Inc. · 1995
- Method of forming a copper oxide film to etch a copper surface evenly53US 6,261,953 B1Kabushiki Kaisha Toshiba · 2001
- Adhesion promoter for printed circuits50US 4,409,037 AMacDermid, Incorporated · 1983