Method for manufacturing laminate
AssigneeNamics Corporation
InventorsNaoki OBATA, Makiko SATO
Life of this patent
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Abstract
The present invention is directed to provide novel methods for manufacturing laminates. The method includes the steps of: bonding the insulating substrate layer and a copper component having protrusions on a surface thereof; transferring the protrusions to a surface of the insulating substrate layer by peeling off the copper component to form a seed layer; forming a resist on a predetermined area of a surface of the seed layer; plating, with copper, the surface of the seed layer in an area where the resist has not been layered to laminate the copper; removing the resist; and removing the seed layer that has been exposed by the removal of the resist.
Claims19
A method for manufacturing a laminate of an insulating substrate layer and copper, comprising the steps of:
- bonding an insulating substrate and a copper component having protrusions on a surface thereof;
- transferring the protrusions to a surface of the insulating substrate by peeling off the copper component to form a seed layer;
- forming a resist on a predetermined area of a surface of the seed layer;
- plating, with copper, the surface of the seed layer in an area where the resist has not been layered to laminate the copper;
- removing the resist;
- and
- removing the seed layer that has been exposed by the removal of the resist.
Dependencies are inferred from the claim text.