Copper surface passivation composition, use thereof, and photoresist stripper containing same
AssigneeZhejiang Aufirst Material Technology Co., Ltd.
InventorsJun HOU, Jing LV
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Abstract
The present invention relates to a copper surface passivation composition, comprising 4-(2-pyridineazo) resorcinol and glucosamine derivatives, and also relates to a photoresist stripper containing same and a method for cleaning a copper substrate. The copper surface passivation composition provides a good copper passivation protection performance, so that the copper surface passivation composition can be used for photoresist removal and copper surface passivation protection in a bumping process of semiconductor back-end packaging with good industrial application prospects and promotion potential in the technical field of microelectronics.
Claims23
A copper surface passivation composition, wherein the copper surface passivation composition comprises 4-(2-pyridineazo) resorcinol and a glucosamine derivative.
Dependencies are inferred from the claim text.