C23C 18/24
Using acid aqueous solutions
Official title: using acid aqueous solutions
C23C18/24 (Using acid aqueous solutions) appears on 154 US grants and 178 published applications in this corpus.
Search patents in C23C- Granted patents
- 154
- Published applications
- 178
- Assignees
- 131
- Inventors
- 512
- Latest grant
- 24 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 4 | 0 |
| 1982 | 5 | 0 |
| 1983 | 4 | 0 |
| 1984 | 4 | 0 |
| 1985 | 5 | 0 |
| 1986 | 6 | 0 |
| 1987 | 3 | 0 |
| 1988 | 1 | 0 |
| 1989 | 4 | 0 |
| 1990 | 3 | 0 |
| 1991 | 4 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 4 | 0 |
| 1995 | 7 | 0 |
| 1996 | 2 | 0 |
| 1997 | 4 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 6 |
| 2004 | 3 | 9 |
| 2005 | 1 | 4 |
| 2006 | 1 | 3 |
| 2007 | 1 | 2 |
| 2008 | 1 | 3 |
| 2009 | 2 | 7 |
| 2010 | 2 | 4 |
| 2011 | 2 | 6 |
| 2012 | 0 | 7 |
| 2013 | 2 | 2 |
| 2014 | 0 | 3 |
| 2015 | 6 | 12 |
| 2016 | 4 | 9 |
| 2017 | 3 | 11 |
| 2018 | 2 | 4 |
| 2019 | 5 | 23 |
| 2020 | 5 | 17 |
| 2021 | 9 | 5 |
| 2022 | 6 | 12 |
| 2023 | 8 | 6 |
| 2024 | 7 | 8 |
| 2025 | 6 | 9 |
| 2026 | 3 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Resin material treatment method, and compositions for the same24 Mar 2026US 12,584,225 B1Okuno Chemical Industries Co., Ltd.
- Method for improving adhesion between metallization layers and ozone-etched plastics3 Feb 2026US 12,540,404 B2MacDermid Enthone Inc.
- Pretreatment method for electroless plating, and pretreatment solution for electroless plating20 Jan 2026US 12,529,145 B2C. Uyemura & Co., Ltd.
- Phenol resin composition7 Oct 2025US 12,435,216 B2Sumitomo Bakelite Co., Ltd.
- Method for etching at least one surface of a plastic substrate7 Oct 2025US 12,435,273 B2Atotech Deutschland GmbH
- Thermoplastic resin composition, method of preparing thermoplastic resin composition, molded article including thermoplastic resin composition, and method of manufacturing molded article20 Aug 2026US 2026/0242585 A1LG Chem.Ltd.
- Chromium acid etching free metal plating of blends of acrylonitrile-butadiene-styrene and polar polymer16 Jul 2026US 2026/0201157 A1Sabic Global Technologies B.V.
- Chromium-plated component and production method for same9 Jul 2026US 2026/0193805 A1Jcu Corporation
- Resin material treatment method, and compositions for the same25 Jun 2026US 2026/0176767 A1Okuno Chemical Industries Co., Ltd.
- Method for providing a conductive surface on a non-conductive polymeric surface19 Mar 2026US 2026/0078495 A1Cirrus Materials Science Ltd
Most cited
By later US patents
- Adhesive for electroless plating, printed circuit boards and method of producing the same101US 5,055,321 AIbiden Co., Ltd. · 1991
- Methods for patterned deposition on a substrate50US 5,380,474 ASandia Corporation · 1995
- Process for metallizing non-conductive substrates44US 4,976,990 AMacDermid, Incorporated · 1990
- Method of obtaining electroless nickel coated filled epoxy resin article41US 4,113,899 AWear-Cote International, Inc. · 1978
- Process for the photoselective metallization on non-conductive plastic base materials39US 4,594,311 AKollmorgen Technologies Corporation · 1986