C23C 18/204
Radiation
Official title: {Radiation, e.g. UV, laser}
C23C18/204 (Radiation) appears on 176 US grants and 229 published applications in this corpus.
Search patents in C23C- Granted patents
- 176
- Published applications
- 229
- Assignees
- 141
- Inventors
- 527
- Latest grant
- 6 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 4 | 0 |
| 1987 | 7 | 0 |
| 1988 | 2 | 0 |
| 1989 | 4 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 6 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 1 |
| 2002 | 1 | 0 |
| 2003 | 0 | 1 |
| 2004 | 1 | 6 |
| 2005 | 0 | 15 |
| 2006 | 4 | 5 |
| 2007 | 5 | 7 |
| 2008 | 3 | 7 |
| 2009 | 6 | 5 |
| 2010 | 1 | 2 |
| 2011 | 4 | 12 |
| 2012 | 5 | 6 |
| 2013 | 2 | 4 |
| 2014 | 7 | 18 |
| 2015 | 12 | 32 |
| 2016 | 10 | 34 |
| 2017 | 18 | 17 |
| 2018 | 18 | 9 |
| 2019 | 9 | 13 |
| 2020 | 7 | 9 |
| 2021 | 7 | 7 |
| 2022 | 7 | 10 |
| 2023 | 3 | 4 |
| 2024 | 3 | 3 |
| 2025 | 3 | 2 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of manufacturing a mold for injection molding6 Jan 2026US 12,515,379 B2Hella GmbH & Co. KGaA
- Semiconductor package23 Sep 2025US 12,426,164 B2Resonac Corporation
- Method for surface treatment prior to metallization5 Aug 2025US 12,378,671 B2Cuptronic Technology Ltd.
- Plated substrate13 May 2025US 12,297,542 B2Murata Manufacturing Co., Ltd.
- Wiring board and production method for same4 Jun 2024US 12,004,305 B2Resonac Corporation
- Surface modification method, method for producing resin plating material, and electroless plating apparatus20 Mar 2025US 2025/0092526 A1Ushio Denki Kabushiki Kaisha
- Polycarbonate Compositions with Flame Retardant Properties for Laser Activating Plating Processes13 Mar 2025US 2025/0084247 A1Shpp Global Technologies B.V.
- Method and a device for applying a metallic coating to a surface12 Dec 2024US 2024/0410056 A1Midnex AG
- Semiconductor package12 Sep 2024US 2024/0306308 A1Resonac Corporation
- Plated molding, method of producing plated molding, and housing component30 May 2024US 2024/0174859 A1Toray Industries, Inc.
Most cited
By later US patents
- Conductor track structures and method for production thereof118US 7,060,421 B2Lpkf Laser & Electronics AG · 2006
- Selective deposition of copper95US 4,574,095 AInternational Business Machines Corporation · 1986
- Patterned deposition of metals via photochemical decomposition of metal-oxalate complexes51US 5,281,447 AInternational Business Machines Corporation · 1994
- Methods for patterned deposition on a substrate50US 5,380,474 ASandia Corporation · 1995
- Process for preparing selectively conductive materials by electroless metal deposition and product made therefrom40US 5,498,467 AW. L. Gore & Associates, Inc. · 1996