Wiring board and production method for same
AssigneeResonac Corporation
InventorsMasaya Toba, Kazuhiko Kurafuchi, Takashi Masuko, Kazuyuki Mitsukura, Shinichiro Abe
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Abstract
A wiring board according to the present disclosure includes a first insulating material layer having a surface with an arithmetic average roughness Ra of 100 nm or less, a metal wiring provided on the surface of the first insulating material layer, and a second insulating material layer provided to cover the metal wiring, in which the metal wiring is configured by a metal layer in contact with the surface of the first insulating material layer and a conductive part stacked on a surface of the metal layer, and a nickel content rate of the metal layer is 0.25 to 20% by mass.
Claims13
A method for manufacturing a wiring board, the method comprising, in a following order:
- (a) a step of adsorbing an electroless plating catalyst to a first insulating material layer;
- (b) a step of forming a metal layer on a surface of the first insulating material layer by electroless plating;
- (c) a step of forming a resist having an opening for wiring pattern formation on a surface of the metal layer;
- and
- (d) a step of forming a conductive part in a region, which is the surface of the metal layer and is exposed from the resist, by electrolytic plating, wherein
- an arithmetic average roughness Ra of the surface of the first insulating material layer is 100 nm or less, and
- a nickel content rate of the metal layer is 0.25 to 20% by mass.
A wiring board comprising:
- a first insulating material layer having a surface with an arithmetic average roughness Ra of 100 nm or less;
- a metal wiring provided on the surface of the first insulating material layer;
- and
- a second insulating material layer provided to cover the metal wiring, wherein
- the metal wiring is configured by a metal layer in contact with the surface of the first insulating material layer and a conductive part stacked on a surface of the metal layer, and
- a nickel content rate of the metal layer is 0.25 to 20% by mass.
Dependencies are inferred from the claim text.