C09J 2479/086
In the substrate
Official title: in the substrate
C09J2479/086 (In the substrate) appears on 161 US grants and 247 published applications in this corpus.
Search patents in C09J- Granted patents
- 161
- Published applications
- 247
- Assignees
- 120
- Inventors
- 574
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 2 | 0 |
| 2001 | 4 | 1 |
| 2002 | 1 | 3 |
| 2003 | 4 | 8 |
| 2004 | 7 | 4 |
| 2005 | 2 | 2 |
| 2006 | 1 | 8 |
| 2007 | 1 | 7 |
| 2008 | 3 | 7 |
| 2009 | 2 | 9 |
| 2010 | 4 | 9 |
| 2011 | 5 | 5 |
| 2012 | 6 | 15 |
| 2013 | 6 | 8 |
| 2014 | 1 | 9 |
| 2015 | 3 | 6 |
| 2016 | 4 | 14 |
| 2017 | 7 | 12 |
| 2018 | 5 | 23 |
| 2019 | 11 | 10 |
| 2020 | 20 | 14 |
| 2021 | 7 | 15 |
| 2022 | 8 | 24 |
| 2023 | 9 | 9 |
| 2024 | 11 | 12 |
| 2025 | 10 | 9 |
| 2026 | 9 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Mount tape having an inner support layer between adhesive layers for semiconductor device assembly22 Sep 2026US 12,745,601 B2Micron Technology, Inc.
- Resin composition for temporary fixation, substrate-conveying support tape, and electronic equipment device manufacturing method4 Aug 2026US 12,698,369 B2
- Adhesive tape28 Jul 2026US 12,692,417 B23M Innovative Properties Company
- Separator for non-aqueous secondary battery and non-aqueous secondary battery19 May 2026US 12,633,621 B2Teijin Limited
- Direct application of thermosetting composite surfacing films to UV-treated thermoplastic surfaces and related composite structures31 Mar 2026US 12,589,555 B2Henkel AG & Co. KGaA
- Separator for non-aqueous secondary battery and non-aqueous secondary battery23 Jul 2026US 2026/0213343 A1Teijin Limited
- Adhesive resin composition for surface modification, manufacturing, method and uses thereof18 Jun 2026US 2026/0167852 A1Magnekon, S. A. De C. V.
- Adhesive sheet, adhesive agent composition, and structure19 Mar 2026US 2026/0078285 A1Dai Nippon Printing Co.Ltd.
- Adhesive protective film, optical member comprising the same, and optical display apparatus comprising the same5 Mar 2026US 2026/0062594 A1Samsung SDI.Co., Ltd.
- Adhesive sheet for provisional fixation of electronic component20 Nov 2025US 2025/0354034 A1Nitto Denko Corporation
Most cited
By later US patents
- Adhesive tapes247US 5,277,972 ATomoegawa Paper Co., Ltd. · 1994
- Adhesive tapes220US 5,683,806 ATomoegawa Paper Co., Ltd. · 1997
- Alpha-particle protection of semiconductor devices90US 4,761,335 ANational Starch and Chemical Corporation · 1988
- Sound-permeable film, electronic component with sound-permeable film, and method of producing circuit board having electronic component mounted thereon64US 8,141,678 B2Nitto Denko Corporation · 2012
- Flexible electronic circuits with embedded integrated circuit die30US 9,899,330 B2MC10, Inc. · 2018