C09J 2479/00
Presence of polyamine or polyimide
C09J2479/00 (Presence of polyamine or polyimide) appears on 313 US grants and 502 published applications in this corpus.
Search patents in C09J- Granted patents
- 313
- Published applications
- 502
- Assignees
- 234
- Inventors
- 1,206
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 4 | 0 |
| 2000 | 5 | 0 |
| 2001 | 8 | 2 |
| 2002 | 8 | 8 |
| 2003 | 5 | 13 |
| 2004 | 10 | 8 |
| 2005 | 5 | 9 |
| 2006 | 4 | 12 |
| 2007 | 3 | 14 |
| 2008 | 5 | 9 |
| 2009 | 5 | 14 |
| 2010 | 7 | 14 |
| 2011 | 8 | 14 |
| 2012 | 9 | 20 |
| 2013 | 9 | 17 |
| 2014 | 3 | 12 |
| 2015 | 7 | 18 |
| 2016 | 7 | 29 |
| 2017 | 17 | 26 |
| 2018 | 11 | 40 |
| 2019 | 19 | 28 |
| 2020 | 35 | 32 |
| 2021 | 18 | 31 |
| 2022 | 16 | 46 |
| 2023 | 19 | 27 |
| 2024 | 22 | 27 |
| 2025 | 17 | 24 |
| 2026 | 19 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Mount tape having an inner support layer between adhesive layers for semiconductor device assembly22 Sep 2026US 12,745,601 B2Micron Technology, Inc.
- All-aromatic liquid-crystalline homo-polyimides with aromatic endgroups and crosslinked products therefrom15 Sep 2026US 12,734,747 B2The United States of America as represented by the Secretary of the Air Force
- All-aromatic liquid-crystalline homo-polyimides with aromatic endgroups and crosslinked products therefrom15 Sep 2026US 12,734,748 B2The United States of America as represented by the Secretary of the Air Force
- Resin composition for temporary fixation, substrate-conveying support tape, and electronic equipment device manufacturing method4 Aug 2026US 12,698,369 B2
- Adhesive tape28 Jul 2026US 12,692,417 B23M Innovative Properties Company
- Pressure-sensitive adhesive tape1 Oct 2026US 2026/0297396 A1Nitto Denko Corporation
- Curable resin composition23 Jul 2026US 2026/0209565 A1Shin-Etsu Chemical Co., Ltd.
- Separator for non-aqueous secondary battery and non-aqueous secondary battery23 Jul 2026US 2026/0213343 A1Teijin Limited
- Adhesive resin composition for surface modification, manufacturing, method and uses thereof18 Jun 2026US 2026/0167852 A1Magnekon, S. A. De C. V.
- Laser-releasable bonding materials for 3-d ic applications16 Apr 2026US 2026/0107739 A1Brewer Science Inc.
Most cited
By later US patents
- Adhesive tapes247US 5,277,972 ATomoegawa Paper Co., Ltd. · 1994
- Adhesive tapes220US 5,683,806 ATomoegawa Paper Co., Ltd. · 1997
- Alpha-particle protection of semiconductor devices90US 4,761,335 ANational Starch and Chemical Corporation · 1988
- Sound-permeable film, electronic component with sound-permeable film, and method of producing circuit board having electronic component mounted thereon64US 8,141,678 B2Nitto Denko Corporation · 2012
- Ink-imprintable release coatings, and pressure sensitive adhesive constructions57US 6,074,747 AAvery Dennison Corporation · 2000