Adhesive tape
Assignee3M Innovative Properties Company
InventorsYunshu Zhang, Yi Lei Zhu, Chao Yang, Xue-hua Chen, Lei Dong
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Abstract
Provided in the present invention is an adhesive tape, including: a base film, having a coefficient of thermal expansion within a range of 4.5 to 15 ppm/° C.; and an adhesive layer, including polyether ether ketone having a crystallinity equal to or less than 10% and an elastic modulus between 10 and 100 MPa at 150-300° C. The adhesive tape according to the technical solution of the present invention can effectively avoid problems such as chip tilt, packaging material flash, contamination caused by an adhesive residue, lead frame warpage, and the like during back-end packaging of a semiconductor device.
Claims14
An adhesive tape, comprising:
- a base film, having a coefficient of thermal expansion within a range of 4.5 to 15 ppm/° C.
- when tested from of −150° C.-1000° C.;
- and
- an adhesive layer, comprising polyether ether ketone having a crystallinity equal to or less than 10% and an elastic modulus between 10 and 100 MPa at 150-300° C., wherein the adhesive layer is bonded to the base film.
Dependencies are inferred from the claim text.