Curable resin composition

A curable resin composition comprising:

• (A) cyclic imide resins represented by the following formula (1) in an amount of 20.0 to 99.0% by mass based on the whole mass of the composition,
• wherein each independently represents a tetravalent organic group containing a cyclic structure, each Q independently represents a divalent aliphatic hydrocarbon group having 6 or more carbon atoms and optionally containing a heteroatom, or a divalent hydrocarbon group derived from a dimer acid skeleton, each B independently represents an arylene group having 6 or more carbon atoms and optionally containing a heteroatom, each X independently represents a hydrogen atom or a methyl group, n is 0 to 200, m is 0 to 200, and the repeating units in brackets with the subscripts n and m are bonded in an order that is not limited;
• and
• (B) a curing catalyst in an amount of 0.1 to 5.0% by mass based on the whole mass of the composition,
• wherein the cyclic imide resins (A) contain
• a cyclic imide resin (A1) represented by the formula (1) in which n+m is 21 or greater, and
• a cyclic imide resin (A2) represented by the formula (1) in which n is 0 to 10 and m is 0 to 10,
• wherein the cyclic imide resins (A) contain the cyclic imide resins (A1) and (A2) in a mass ratio of (A1):(A2)=98:2 to 50:50, and
• wherein the curable resin composition satisfies all of the following conditions (α) to (δ) in which:
• (α) the resin composition has a minimum complex viscosity at 40 to 150° C. of 100 to 10,000 Pa·s as measured at a frequency of 1 Hz,
• (β) the resin composition has a minimum complex viscosity at 40 to 150° C. of 10 to 2,000 Pa·s as measured at a frequency of 2 Hz,
• (γ) a cured product of the resin composition has a die shear strength with glass at 25° C. of 10 MPa or more, and
• (δ) a cured product of the resin composition has a die shear strength with copper at 25° C. of 10 MPa or more.